公开(公告)号：US20220395254A1

公开(公告)日：2022-12-15

申请号：US17853835

申请日：2022-06-29

Applicant: BFLY Operations, Inc.

Inventor： Keith G. Fife ,  Jianwei Liu ,  Andrew Betts

IPC: A61B8/00 ,  B06B1/06 ,  B81C1/00 ,  B81B7/00

Abstract: Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.

公开(公告)号：US12178648B2

公开(公告)日：2024-12-31

申请号：US17853835

申请日：2022-06-29

Applicant: BFLY Operations, Inc.

Inventor： Keith G. Fife ,  Jianwei Liu ,  Andrew Betts

IPC: B06B1/06 ,  A61B8/00 ,  B81B7/00 ,  B81C1/00 ,  H10N30/03

Abstract: Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.