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公开(公告)号：US12172188B2
公开(公告)日：2024-12-24
申请号：US17685991
申请日：2022-03-03
Applicant: BFLY OPERATIONS, INC.
Inventor： Jianwei Liu , Lingyun Miao , Victor L. Pushparaj , Nikhil Apte
Abstract: An ultrasonic transducer is described. The ultrasonic transducer comprises a membrane and a substrate disposed opposite the membrane such that a cavity is formed therebetween. The substrate comprises an electrode region and pedestals protruding from a surface of the substrate and having a height greater than a height of the electrode region, the pedestals being electrically isolated from the electrode region.
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公开(公告)号：US11883845B2
公开(公告)日：2024-01-30
申请号：US18093701
申请日：2023-01-05
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
CPC classification number: B06B1/0292 , B81B3/001 , B81C1/00984 , B81B2203/0127 , B81B2203/0315 , B81B2203/0392 , B81C2201/0109 , B81C2201/0125 , B81C2201/0176
Abstract: A method of forming an ultrasonic transducer device involves depositing a first layer on a substrate, depositing a second layer on the first layer, patterning the second layer at a region corresponding to a location of a transducer cavity, depositing a third layer that refills regions created by patterning the second layer, planarizing the third layer to a top surface of the second layer, removing the second layer, conformally depositing a fourth layer over the first layer and the third layer, defining the transducer cavity in a support layer formed over the fourth layer; and bonding a membrane to the support layer.
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公开(公告)号：US11766696B2
公开(公告)日：2023-09-26
申请号：US16784186
申请日：2020-02-06
Applicant: BFLY Operations, Inc.
Inventor： Lingyun Miao , Jianwei Liu , Jonathan M. Rothberg
CPC classification number: B06B1/0292 , H10N30/06 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81C2201/0101 , B81C2201/013 , B81C2201/0147 , B81C2201/0174 , B81C2203/0714
Abstract: A method of forming an ultrasonic transducer device includes forming a patterned metal electrode layer over a substrate, the patterned metal electrode layer comprising a lower layer and an upper layer formed on the lower layer; forming an insulation layer over the patterned metal electrode layer; and planarizing the insulation layer to the upper layer of the patterned metal electrode layer, wherein the upper layer comprises a electrically conductive material that serves as a chemical mechanical polishing (CMP) stop layer that has CMP selectivity with respect to the insulation layer and the lower layer, and wherein the upper layer has a CMP removal rate slower than that of the insulation layer.
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公开(公告)号：US11501562B2
公开(公告)日：2022-11-15
申请号：US16859124
申请日：2020-04-27
Applicant: BFLY Operations, Inc.
Inventor： Tyler S. Ralston , Jonathan M. Rothberg , Jianwei Liu
IPC: G06V40/16 , A61B5/1171 , A61B5/00 , G01S7/52 , G01S7/539
Abstract: An electronic face-identification device, which performs face scanning with ultrasonic waves, includes a housing and an ultrasound device disposed within the housing. The ultrasound device may be configured to transmit ultrasonic waves through air to a face and scan the face with the ultrasonic waves, to receive reflected waves through the air corresponding to reflections of the ultrasonic waves from the face, and to perform a recognition process for the face based on reflections of the ultrasonic waves from the face. The ultrasound device may include a plurality of ultrasound transducers, and electronic circuitry configured to transmit signals to the ultrasound transducers and receive signals from the ultrasound transducers. The face-identification device may be incorporated into various electronic equipment, such as hand-held equipment in the form of smartphones and tablet computers, as well as in larger scale installations at airports, workplace entryways, and the like.
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公开(公告)号：US11676874B2
公开(公告)日：2023-06-13
申请号：US17191829
申请日：2021-03-04
Applicant: BFLY Operations, Inc.
Inventor： Jianwei Liu , Keith G. Fife
IPC: H01L23/31 , H01L23/498 , H01L21/56 , H01L23/00 , A61B8/00
CPC classification number: H01L23/3128 , A61B8/44 , H01L21/568 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/32 , H01L24/83 , H01L24/16 , H01L24/73 , H01L2224/16235 , H01L2224/32225 , H01L2224/73253 , H01L2224/8384
Abstract: Described herein are methods and apparatuses for packaging an ultrasound-on-a-chip. An ultrasound-on-a-chip may be coupled to a redistribution layer and to an interposer layer. Encapsulation may encapsulate the ultrasound-on-a-chip device and first metal pillars may extend through the encapsulation and electrically couple to the redistribution layer. Second metal pillars may extend through the interposer layer. The interposer layer may include aluminum nitride. The first metal pillars may be electrically coupled to the second metal pillars. A printed circuit board may be coupled to the interposer layer.
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Patent Agency Ranking
公开(公告)号：US11571711B2
公开(公告)日：2023-02-07
申请号：US16683652
申请日：2019-11-14
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Keith G. Fife , Jianwei Liu , Jonathan M. Rothberg
Abstract: A method of forming an ultrasonic transducer device includes forming an insulating layer having topographic features over a lower transducer electrode layer of a substrate; forming a conformal, anti-stiction layer over the insulating layer such that the conformal layer also has the topographic features; defining a cavity in a support layer formed over the anti-stiction layer; and bonding a membrane to the support layer.
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公开(公告)号：US11354926B2
公开(公告)日：2022-06-07
申请号：US16705504
申请日：2019-12-06
Applicant: BFLY Operations, Inc.
Inventor： Jianwei Liu , Keith G. Fife , Sarp Satir
Abstract: Aspects of the technology described herein relate to sensing a fingerprint of a subject via an ultrasound fingerprint sensor. Certain aspects relate to transmitting and receiving ultrasound data at multiple different frequencies to provide sensing data from different depths within the skin of the subject. Since different ultrasound frequencies are expected to penetrate a subject's skin to different degrees, sensing a finger at multiple ultrasound frequencies may provide information on different physical aspects of the finger. For instance, sound ultrasound frequencies may sense a surface of the skin, whereas other ultrasound frequencies may penetrate through one or more of the epidermal, dermal or subcutaneous layers. The ultrasound fingerprint apparatus may have utility in various applications, including but not limited to mobile electronic devices, such as mobile phones or tablet computers, a laptop computer or biometric access equipment.
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公开(公告)号：US12178648B2
公开(公告)日：2024-12-31
申请号：US17853835
申请日：2022-06-29
Applicant: BFLY Operations, Inc.
Inventor： Keith G. Fife , Jianwei Liu , Andrew Betts
Abstract: Aspects of the disclosure described herein related to packaging an ultrasound-on-a-chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through-silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.
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公开(公告)号：US12070773B2
公开(公告)日：2024-08-27
申请号：US18099456
申请日：2023-01-20
Applicant: BFLY OPERATIONS, INC.
Inventor： Lingyun Miao , Jianwei Liu , Keith G. Fife
CPC classification number: B06B1/0292 , B81B3/0021 , B81C1/00158 , B81B2201/0271 , B81B2203/0127 , B81B2203/0315 , B81B2203/04 , B81C2201/0125 , B81C2201/013 , B81C2201/0176 , B81C2203/03
Abstract: An ultrasonic transducer device includes a patterned film stack disposed on first regions of a substrate, the patterned film stack including a metal electrode layer and a bottom cavity layer formed on the metal electrode layer. The ultrasonic transducer device further includes a planarized insulation layer disposed on second regions of the substrate layer, a cavity formed in a membrane support layer and a CMP stop layer, the CMP stop layer including a top layer of the patterned film stack and the membrane support layer formed over the patterned film stack and the planarized insulation layer. The ultrasonic transducer device also includes a membrane bonded to the membrane support layer. The CMP stop layer underlies portions of the membrane support layer but not the cavity.
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公开(公告)号：US12053323B2
公开(公告)日：2024-08-06
申请号：US16401870
申请日：2019-05-02
Applicant: BFLY Operations, Inc.
Inventor： Keith G. Fife , Jianwei Liu , Jungwook Yang , Joseph Lutsky
CPC classification number: A61B8/12 , B06B1/0207 , B06B1/0292 , B06B1/0622 , G01N29/2406 , H10N30/204
Abstract: Micromachined ultrasonic transducers having pressure ports are described. The micromachined ultrasonic transducers may comprise flexible membranes configured to vibrate over a cavity. The cavity may be sealed, in some instances by the membrane itself. A pressure port may provide access to the cavity, and thus control of the cavity pressure. In some embodiments, an ultrasound device including an array of micromachined ultrasonic transducers is provided, with pressure ports for at least some of the ultrasonic transducers. The pressure ports may be used to control pressure across the array.
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