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公开(公告)号：US20210161003A1
公开(公告)日：2021-05-27
申请号：US17102027
申请日：2020-11-23
Applicant: BIO-RAD LABORATORIES, INC.
Inventor： Amir SADRI , Neven NIKOLIC , Gabriel CULINCO , Thanh-Vi TRAN , Nenad KIRCANSKI
Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.
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公开(公告)号：US20180299476A1
公开(公告)日：2018-10-18
申请号：US15943366
申请日：2018-04-02
Applicant: Bio-Rad Laboratories, Inc.
Inventor： Nenad KIRCANSKI , Wen-I WU , Amir SADRI , Manja KIRCANSKI , Neven NIKOLIC , Thanh-Vi TRAN
Abstract: Fraction collector dispensers and methods of using such dispensers are provided. In one embodiment, the dispenser includes an inlet for receiving liquid from a liquid source, wherein the inlet is in fluid communication with an outlet from which liquid is dispensed into a receptacle; and a reservoir in fluid communication with a flow path between the inlet and outlet, wherein the reservoir is configured to receive liquid during movement of the dispenser between receptacles or during movement of receptacles between dispense positions and to receive pressurized air or gas to empty liquid out of the reservoir before or after movement of the dispenser or receptacles, wherein the dispenser is moveable between a first receptacle and a second receptacle or the receptacles are moveable between dispense positions.
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公开(公告)号：US20220312586A1
公开(公告)日：2022-09-29
申请号：US17841931
申请日：2022-06-16
Applicant: Bio-Rad Laboratories, Inc.
Inventor： Amir SADRI , Neven NIKOLIC , Gabriel CULINCO , Thanh-Vi TRAN , Nenad KIRCANSKI
Abstract: A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.
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