公开(公告)号：US20220320394A1

公开(公告)日：2022-10-06

申请号：US17449058

申请日：2021-09-27

申请人： BOE MLED TECHNOLOGY CO., LTD. ,  BOE TECHNOLOGY GROUP CO., LTD.

发明人： Xaiwei Yun ,  Chenchang Chen ,  Wenchieh Huang ,  Bo Gao ,  Xuehai Qian ,  Meiling Jin ,  Wenjia Sun ,  Xiaozhou Liu

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L33/50 ,  H01L33/00

摘要： A miniature light emitting diode chip, a display substrate and a manufacturing method thereof, and a display device are provided. The miniature light emitting diode chip includes: a substrate, including a first side and a second side; a first contact portion and a plurality of contact portions; and a plurality of miniature light emitting diodes. The miniature light emitting diodes each include a first electrode and a second electrode. An orthographic projection of a combination of the plurality of miniature light emitting diodes and a spacing between any two of the plurality of miniature light emitting diodes falls within the substrate. The first electrode of each of the plurality of miniature light emitting diodes is electrically connected to the first contact potion, and the second electrode of each of the plurality of miniature light emitting diodes is electrically connected to the plurality of second contact portions, respectively.