公开(公告)号：US11980047B2

公开(公告)日：2024-05-07

申请号：US17259238

申请日：2020-03-27

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shengji Yang ,  Xue Dong ,  Xiaochuan Chen ,  Pengcheng Lu ,  Hui Wang ,  Yanming Wang ,  Yage Song ,  Jiantong Li ,  Kuanta Huang

IPC: H10K50/824 ,  H10K59/122 ,  H10K59/131

CPC classification number: H10K50/824 ,  H10K59/122 ,  H10K59/131

Abstract: A display panel includes a driving back plate, a first insulating layer, and a light-emitting device layer sequentially stacked. The driving back plate includes a first reflecting electrode layer. The first reflecting electrode layer includes first primary reflecting electrodes in a display area and first auxiliary reflecting electrodes in a peripheral area. The light-emitting device layer includes a second reflecting electrode layer including second primary reflecting electrodes in the display area and second auxiliary reflecting electrodes in the peripheral area. The second primary reflecting electrodes are in one-to-one correspondence and electrically connected with the first primary reflecting electrodes. The orthographic projection of the second primary reflecting electrode on the first reflecting electrode layer are located within the first primary reflecting electrode.

公开(公告)号：US11539017B2

公开(公告)日：2022-12-27

申请号：US16960046

申请日：2019-08-23

Applicant: BOE TECHNOLOGY GROUP CO., LTD

Inventor： Shengji Yang ,  Hui Wang ,  Xiaochuan Chen ,  Kuanta Huang ,  Yanming Wang ,  Pengcheng Lu ,  Yage Song ,  Guangtong Liu ,  Jiantong Li

IPC: H01L51/50 ,  H01L27/32 ,  H01L51/56

Abstract: A display substrate and a manufacturing method thereof are provided. The display substrate includes a base substrate, as well as a first conductive layer, an organic functional layer and a second conductive layer which are on the base substrate sequentially, and the organic functional layer includes a carrier injection layer including a first carrier injection layer portion and a second carrier injection layer portion which are in a first sub-pixel area and a second sub-pixel area respectively; the display substrate further includes a spacer which separates the first carrier injection layer portion and the second carrier injection layer portion, and the carrier injection layer further includes a third carrier injection layer portion which is separated from the first carrier injection layer portion and the second carrier injection layer portion respectively.

公开(公告)号：US20210408429A1

公开(公告)日：2021-12-30

申请号：US16960046

申请日：2019-08-23

Applicant: Boe Technology Group Co., Ltd.

Inventor： Shengji YANG ,  Hui Wang ,  Xiaochuan Chen ,  Kuanta Huang ,  Yanming Wang ,  Pengcheng Lu ,  Yage Song ,  Guangtong LIU ,  Jiantong Li

IPC: H01L51/50 ,  H01L51/56 ,  H01L27/32

Abstract: A display substrate and a manufacturing method thereof are provided. The display substrate includes a base substrate, as well as a first conductive layer, an organic functional layer and a second conductive layer which are on the base substrate sequentially, and the organic functional layer includes a carrier injection layer including a first carrier injection layer portion and a second carrier injection layer portion which are in a first sub-pixel area and a second sub-pixel area respectively; the display substrate further includes a spacer which separates the first carrier injection layer portion and the second carrier injection layer portion, and the carrier injection layer further includes a third carrier injection layer portion which is separated from the first carrier injection layer portion and the second carrier injection layer portion respectively.

公开(公告)号：US10886356B2

公开(公告)日：2021-01-05

申请号：US16394254

申请日：2019-04-25

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Pengcheng Lu ,  Kuanta Huang ,  Xiaochuan Chen ,  Shengji Yang ,  Hui Wang ,  Yanming Wang ,  Weihai Wang ,  Guohong Qin ,  Rongrong Shi ,  Yage Song ,  Jiantong Li

IPC: H01L27/32 ,  H01L27/12 ,  H01L51/52

Abstract: A display panel includes a base substrate, a first electrode contact portion, a light emitting layer, and a first electrode. The first electrode contact portion is disposed on the base substrate and surrounding a display area, and is separated from the display area by an isolation area. The light emitting layer covers the display area and at least a portion of the isolation area, and extends at least partially to an inner edge of the first electrode contact portion or a surface of the first electrode contact portion away from the base substrate. The first electrode is disposed on the light emitting layer and a portion of the first electrode contact portion that is not covered by the light emitting layer.

公开(公告)号：US11871625B2

公开(公告)日：2024-01-09

申请号：US17266625

申请日：2020-03-27

Applicant: BOE Technology Group Co., Ltd.

Inventor： Pengcheng Lu ,  Shengji Yang ,  Kuanta Huang ,  Xiaochuan Chen ,  Yage Song ,  Yanming Wang ,  Hui Wang ,  Dongdong Duan ,  Jiantong Li ,  Xiao Bai ,  Yunlong Li ,  Shuai Tian ,  Zhijian Zhu ,  Yu Ao ,  Junbo Wei ,  Chao Pu ,  Yuanlan Tian

IPC: H01L23/00 ,  H10K59/131 ,  H10K59/12

CPC classification number: H10K59/131 ,  H10K59/1201

Abstract: Provided are a display substrate and a preparation method thereof, and a display apparatus. The display substrate includes a silicon-based substrate and an array structure layer arranged on the silicon-based substrate; a driving transistor and a first power line being arranged in the silicon-based substrate in the display area, a light emitting element being disposed on the array structure layer in the display area, a first electrode of the driving transistor being connected with the first power line, and a second electrode of the driving transistor being connected with an anode of the light emitting element; a power supply electrode and a second power line being arranged in the silicon-based substrate in the peripheral area, the power supply electrode being connected with the second power line.

公开(公告)号：US11302869B2

公开(公告)日：2022-04-12

申请号：US16473950

申请日：2018-12-26

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Pengcheng Lu ,  Xiaochuan Chen ,  Shengji Yang ,  Kuanta Huang ,  Hui Wang ,  Yanming Wang ,  Weihai Wang ,  Guohong Qin ,  Yage Song ,  Jiantong Li

IPC: H01L51/52 ,  H01L51/00 ,  H01L27/32

Abstract: A manufacturing method of a via-hole connection structure, a manufacturing method of an array substrate and an array substrate are provided by the embodiments of the present disclosure, and the manufacturing method of the via-hole connection structure includes: forming an insulation layer on a base substrate and forming a first via hole in the insulation layer; forming a connection portion in the first via hole; forming a protection layer covering the connection portion on a surface of the insulation layer; forming a second via hole in the insulation layer and in the protection layer; removing at least a portion of the protection layer to expose the connection portion.