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公开(公告)号：US20170271625A1
公开(公告)日：2017-09-21
申请号：US15305497
申请日：2015-09-28
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： LU LIU , MING CHE HSIEH , BAOMING CAI
IPC: H01L51/56 , H01L27/32 , H01L21/768
Abstract: The present disclosure provides a method for fabricating a display substrate for a display panel. The method includes providing a flexible organic light-emitting diode (flexible OLED) substrate with a thin-film transistor (TFT) layer on the flexible OLED substrate and a patterned adhesive layer on the TFT layer, wherein the TFT layer includes at least one testing area; providing a barrier film (BF) with a patterned laser barrier layer on a surface of the BF, the surface of the BF facing the TFT layer; and bonding the BF onto the flexible OLED substrate such that at least a portion of the patterned laser barrier corresponds to the at least one testing area. The method also includes irradiating a laser beam along a cutting line on the BF to remove a first portion of the BF.
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公开(公告)号：US20170120569A1
公开(公告)日：2017-05-04
申请号：US15031242
申请日：2015-09-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD
Inventor： LU LIU , MING CHE HSIEH
CPC classification number: B32B38/10 , B32B27/281 , B32B37/14 , B32B2255/10 , B32B2255/26 , B32B2457/206 , G02F1/133305 , H01L21/6835 , H01L21/7806 , H01L27/3244 , H01L51/003 , H01L2221/68318 , H01L2221/6835 , H01L2221/68381 , H01L2227/326 , H01L2251/5338
Abstract: A method for fabricating a flexible device is provided. The method includes forming a sacrificial layer on a substrate; and forming a reflective layer to reflect a laser for subsequently de-bonding the sacrificial layer from the rigid substrate back to the sacrificial layer to reduce required de-bonding energy of the laser over at least a portion of the rigid substrate. Further, the method includes forming a flexible device over the reflective layer; and separating the substrate from the sacrificial layer by irradiating the sacrificial layer using the laser.
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