公开(公告)号：US20210375955A1

公开(公告)日：2021-12-02

申请号：US16337557

申请日：2018-10-15

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xueyan TIAN ,  Shiming SHI ,  Shuangliang QIN

IPC: H01L27/12 ,  H01L27/32 ,  H01L51/56 ,  H01L29/786

Abstract: A flexible array substrate, a manufacturing method thereof and a display device are provided. The flexible array substrate includes: a first flexible substrate with a first surface; a thin film transistor on the first surface; and a light-shielding layer between the first flexible substrate and the thin film transistor. An orthographic projection of the light-shielding layer on the first flexible substrate covers an orthographic projection of a channel region of the thin film transistor on the first flexible substrate.

公开(公告)号：US20230253417A1

公开(公告)日：2023-08-10

申请号：US18125171

申请日：2023-03-23

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Xueyan TIAN ,  Shiming SHI ,  Shuangliang QIN

IPC: H01L27/12 ,  H01L29/786 ,  H10K59/126 ,  H10K71/00

CPC classification number: H01L27/1266 ,  H01L29/78633 ,  H10K59/126 ,  H10K71/00 ,  H01L27/1218 ,  H10K59/1201

Abstract: A flexible array substrate, a manufacturing method thereof and a display device are provided. The flexible array substrate includes: a first flexible substrate with a first surface; a thin film transistor on the first surface; and a light-shielding layer between the first flexible substrate and the thin film transistor. An orthographic projection of the light-shielding layer on the first flexible substrate covers an orthographic projection of a channel region of the thin film transistor on the first flexible substrate.