Array substrate, display panel and display device

    公开(公告)号:US11201173B2

    公开(公告)日:2021-12-14

    申请号:US16451168

    申请日:2019-06-25

    IPC分类号: H01L25/18 H01L27/12 H01L23/00

    摘要: Provided are an array substrate, a display panel and a display device. The array substrate includes a display region and a peripheral region. The peripheral region includes a chip-on-film bonding region, and the peripheral region has a recessed structure configured to fill a bonding material. The recessed structure is between the chip-on-film bonding region and a lateral side of the array substrate. The chip-on-film bonding region is between the display region and the lateral side. By disposing a recessed structure configured to fill the bonding material in the peripheral region, a gap is difficult to occur between the chip-on-film in the chip-on-film bonding region and the array substrate, preventing entry of water vapor to cause corrosion of lead wires and short circuits of lead wires. The defect ratio of the array substrate, the display panel, and the display device is reduced, and the product quality is improved.

    ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

    公开(公告)号:US20200006390A1

    公开(公告)日:2020-01-02

    申请号:US16451168

    申请日:2019-06-25

    IPC分类号: H01L27/12 H01L25/18 H01L23/00

    摘要: Provided are an array substrate, a display panel and a display device. The array substrate includes a display region and a peripheral region. The peripheral region includes a chip-on-film bonding region, and the peripheral region has a recessed structure configured to fill a bonding material. The recessed structure is between the chip-on-film bonding region and a lateral side of the array substrate. The chip-on-film bonding region is between the display region and the lateral side. By disposing a recessed structure configured to fill the bonding material in the peripheral region, a gap is difficult to occur between the chip-on-film in the chip-on-film bonding region and the array substrate, preventing entry of water vapor to cause corrosion of lead wires and short circuits of lead wires. The defect ratio of the array substrate, the display panel, and the display device is reduced, and the product quality is improved.

    Backlight assembly and display device

    公开(公告)号:US11598984B2

    公开(公告)日:2023-03-07

    申请号:US17489589

    申请日:2021-09-29

    IPC分类号: G02F1/1333 F21V8/00

    摘要: A backlight assembly and a display device are provided in the present disclosure. The backlight assembly includes an optical lamination layer and a die-casting back plate. The die-casting back plate defines an accommodation space for accommodating the optical lamination layer, the die-casting back plate includes an inner surface and an outer surface arranged opposite to each other, the inner surface is a surface facing a bottom surface of the optical lamination layer, a recess region is arranged on the inner surface, and a plurality of rivets configured to assemble the die-casting back plate onto an object to be assembled is arranged on the outer surface. The plurality of rivets is located in a region corresponding to the recess region and spaced apart from a boundary of the recess region by a spacing.

    Display module and display device
    10.
    发明授权

    公开(公告)号:US11269133B2

    公开(公告)日:2022-03-08

    申请号:US17194228

    申请日:2021-03-06

    摘要: A display module and a display device are described. The display module includes a back plate; a light guide plate disposed on a side of the back plate; a frame including a first base part and a first bulge extending inward, where the first bulge has a first bottom surface, a first end surface, and a second bottom surface jointed in sequence, an end part of the light guide plate is received in a first accommodating cavity and has a first spacing relative to the first bottom surface; an optical film layer disposed on the side of the light guide plate facing away from the back plate, and an end part thereof is located in a second accommodating cavity and has a second spacing relative to the second bottom surface; the first spacing is smaller than the second spacing.