BACKLIGHT MODULE AND DISPLAY DEVICE
    2.
    发明申请

    公开(公告)号:US20190243059A1

    公开(公告)日:2019-08-08

    申请号:US16173961

    申请日:2018-10-29

    IPC分类号: F21V8/00

    摘要: A backlight module and a display device are provided in the present disclosure. The backlight module includes: a light guide plate, a plastic frame and a back plate; the back plate includes an accommodating portion and a folded edge perpendicular to the accommodating portion; the light guide plate is disposed on the accommodating portion; the plastic frame is configured to be in a snap engagement with the folded edge of the back plate and includes an outer blocking wall and a carrying portion perpendicular to the outer blocking wall; and a blocking member is disposed between the folded edge and the light guide plate, and the blocking member is configured to block light leakage at a position where the outer blocking wall and the folded edge are snap engaged.

    DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20210318572A1

    公开(公告)日:2021-10-14

    申请号:US17284580

    申请日:2020-07-23

    IPC分类号: G02F1/1333 G02F1/1335

    摘要: A display device is provided, and the display device includes: a display module, including a first outer surface, a second outer surface and a side surface; a tape, including a first part and a second part, wherein the first part is bonded to an edge of the first outer surface of the display module, and the second part is bonded to the side surface of the display module; a cover component, wherein the cover component and the display module are arranged oppositely and spaced apart; and a tape holder between the cover component and the display module, wherein the tape holder includes a main body portion and at least one through hole formed in the main body portion. A method for manufacturing the display device is further provided.

    Chip on film and display device
    5.
    发明授权

    公开(公告)号:US11355425B2

    公开(公告)日:2022-06-07

    申请号:US16959359

    申请日:2019-12-13

    IPC分类号: H01L23/495 H01L27/12

    摘要: The present disclosure relates to a chip on film and a display device. The chip on film includes a body and an insulating protective film arranged on the body, in which the body includes a first area, a first binding area for binding and connecting to the back surface of the display panel, and a first bendable area located between the first area and the first binding area and capable of being bent in a first direction; and the insulating protection film includes a first connection area connected to the first area, a second connection area for connecting to the back surface of the display panel, and a second bendable area located between the first connection area and the second connection area and capable of being bent in a second direction opposite to the first direction.