METHOD FOR PROCESSING MEDICAL DATA, APPARATUS, AND STORAGE MEDIUM

    公开(公告)号:US20240170161A1

    公开(公告)日:2024-05-23

    申请号:US18282018

    申请日:2023-01-04

    CPC classification number: G16H50/70 G06F18/25 G06F40/30 G16H50/20 G16H50/30

    Abstract: A method for processing medical data, an apparatus and a storage medium, the method includes: acquiring a case-history datum, and performing a target process to obtain a disease-analysis vector, wherein the target process includes: generating a case-history semantic vector of the case-history datum; for each of preset diseases in a preset-disease set, determining a first possibility weight of the case-history datum caused by the preset disease according to the case-history semantic vector, to obtain a first weight vector; according to case-history symptoms and case-history diseases in the case-history datum, determining from a predetermined knowledge graph a candidate disease that is capable of generating generate the case-history datum; determining a second possibility weight of the case-history datum caused by the candidate disease, to obtain a second weight vector; and fusing the first weight vector and the second weight vector, to obtain the disease-analysis vector corresponding to the case-history datum.

    DRIVING SUBSTRATE, LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20220336426A1

    公开(公告)日:2022-10-20

    申请号:US17760627

    申请日:2021-05-18

    Abstract: Provided are a driving substrate, a light emitting apparatus and a manufacturing method therefor, which relate to the technical field of display. According to the present disclosure, a rigid substrate, a debonding layer, a first buffer layer, an organic material layer, a second buffer layer and a wiring layer are sequentially arranged in layer configuration in a component disposing area and a circuit board binding area, and the first buffer layer, an overlapping electrode layer, the organic material layer and the second buffer layer are sequentially arranged in layer configuration in a bending area. Two ends of the overlapping electrode layer respectively extend to the component disposing area and the circuit board binding area, and the wiring layer of the component disposing area and the wiring layer of the circuit board binding area are respectively connected to the overlapping electrode layer through via holes.

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