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公开(公告)号:US12198454B2
公开(公告)日:2025-01-14
申请号:US17513473
申请日:2021-10-28
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Xue Chen , Jinnv Liu , Yude Li , Xianqiang Ni , Shuobin Liang , Li Zhou
IPC: G06V20/64 , A61B5/30 , A61B5/308 , G06F18/2137 , G06F18/214 , G06F18/241 , G06V10/147 , G06V10/42 , G06V10/94 , G16H10/60 , G16H50/20
Abstract: An attention mechanism-based 12-lead electrocardiogram (ECG) classification method is described, the method including acquiring an original image of a 12-lead ECG, segmenting waveform data recorded in the original image to obtain segmented waveform data for each lead in the 12-lead ECG, performing depth feature extraction on the segmented waveform data of said each lead to obtain a first feature map of said each lead, performing feature transformation on the first feature map of said each lead based on an attention mechanism to obtain a depth feature of said each lead, and classifying the depth feature of said each lead to obtain a classification result for the original image. The classification method can make full use of the 12-lead ECG for overall classification and improve the accuracy of image classification.
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公开(公告)号:US12284902B2
公开(公告)日:2025-04-22
申请号:US17771015
申请日:2021-06-10
Applicant: BOE Technology Group Co., Ltd.
Inventor: Zhongyuan Sun , Meng Yan , Che An , Guangcai Yuan , Jinnv Liu
Abstract: A display substrate (910), including a flexible substrate body, a thickness adjustment layer (71), and a micro-lens layer (72). The flexible substrate body includes: a plurality of island-shaped display regions (100) spaced apart from each other, a hollow region (300) disposed between adjacent island-shaped display regions (100), and a connection region (200) for connecting the adjacent island-shaped display regions (100). The thickness adjustment layer (71) is disposed on light exit sides of the plurality of island-shaped display regions (100) of the flexible substrate body. The micro-lens layer (72) is disposed on the side of the thickness adjustment layer (71) away from the flexible substrate body.
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公开(公告)号:US20240170161A1
公开(公告)日:2024-05-23
申请号:US18282018
申请日:2023-01-04
Applicant: BOE Technology Group Co., Ltd.
Inventor: Xue Chen , Jinnv Liu , Yude Li , Xiying Zhang , Zhenzhong Zhang , Li Zhou
Abstract: A method for processing medical data, an apparatus and a storage medium, the method includes: acquiring a case-history datum, and performing a target process to obtain a disease-analysis vector, wherein the target process includes: generating a case-history semantic vector of the case-history datum; for each of preset diseases in a preset-disease set, determining a first possibility weight of the case-history datum caused by the preset disease according to the case-history semantic vector, to obtain a first weight vector; according to case-history symptoms and case-history diseases in the case-history datum, determining from a predetermined knowledge graph a candidate disease that is capable of generating generate the case-history datum; determining a second possibility weight of the case-history datum caused by the candidate disease, to obtain a second weight vector; and fusing the first weight vector and the second weight vector, to obtain the disease-analysis vector corresponding to the case-history datum.
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公开(公告)号:US20220336426A1
公开(公告)日:2022-10-20
申请号:US17760627
申请日:2021-05-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Xiaoyan Zhu , Xinhong Lu , Jinnv Liu
IPC: H01L25/075 , H01L33/62
Abstract: Provided are a driving substrate, a light emitting apparatus and a manufacturing method therefor, which relate to the technical field of display. According to the present disclosure, a rigid substrate, a debonding layer, a first buffer layer, an organic material layer, a second buffer layer and a wiring layer are sequentially arranged in layer configuration in a component disposing area and a circuit board binding area, and the first buffer layer, an overlapping electrode layer, the organic material layer and the second buffer layer are sequentially arranged in layer configuration in a bending area. Two ends of the overlapping electrode layer respectively extend to the component disposing area and the circuit board binding area, and the wiring layer of the component disposing area and the wiring layer of the circuit board binding area are respectively connected to the overlapping electrode layer through via holes.
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