公开(公告)号：US10484772B2

公开(公告)日：2019-11-19

申请号：US15782910

申请日：2017-10-13

Applicant: BOSE CORPORATION

Inventor： Johnpaul P. Barrieau ,  Richard L. Pyatt ,  Jonathan D. Turner ,  Daniel P. Baker

IPC: H04R1/02 ,  H04R1/10

Abstract: Aspects of the present disclosure provide an intentional leak from a rear volume of an ear cup to the atmosphere. The leak is created via a vent in the driver plate acoustic assembly. The vent reduces an acoustic load the ear cup cover creates on a rear cavity of an electroacoustic transducer contained within the driver plate acoustic assembly of a headset. Additionally, the vent is hidden on an assembled ear cup of a headset. Due to the placement of the vent, ear cup cover may have a smooth, seamless surface.