公开(公告)号：US12273674B2

公开(公告)日：2025-04-08

申请号：US17881835

申请日：2022-08-05

Applicant: Bose Corporation

Inventor： Allen T. Graff ,  Daniel C. Haferman ,  Zhen Xu ,  Daniel P. Baker

IPC: H04R1/10

Abstract: Headphones include a cushion assembly, a slider telescopingly received within the cushion assembly, and an earphone. A yoke couples the earphone to the slider. A pivot is disposed at an open end of the slider and couples the yoke to the slider. The pivot includes a barrel that is received within an opening in the yoke. The barrel is secured within the opening via a pin that is inserted into a hole in the yoke.

公开(公告)号：US20240048885A1

公开(公告)日：2024-02-08

申请号：US17881792

申请日：2022-08-05

Applicant: Bose Corporation

Inventor： Allen T. Graff ,  Daniel C. Haferman ,  Zhen Xu ,  Daniel P. Baker

IPC: H04R1/10

CPC classification number: H04R1/10

Abstract: A headphone includes a cushion assembly and a slider telescopically coupled to the cushion assembly. The slider includes a proximal end that is disposed within the cushion assembly and a distal end extending outward from the cushion assembly. A pivot support is disposed within an opening at the distal end of the slider. A pivot is supported in the pivot support. The headphone also includes an earphone and a yoke that couples the earphone to the slider. The pivot support is secured to the slider via a fastener, and wherein the yoke is pivotable to a position in which it covers the fastener when the headphones are in use.

公开(公告)号：US20200077170A1

公开(公告)日：2020-03-05

申请号：US16118739

申请日：2018-08-31

Applicant: Bose Corporation

Inventor： Ryan Joseph Wexler ,  Daniel P. Baker

IPC: H04R1/10

Abstract: Various implementations include an arm for a napeband-style earphone system and a related earphone system. The arm has sections with distinct stiffness in order to flex over the top of a user's pinna for placement of an earphone proximate the ear.

公开(公告)号：US10368157B2

公开(公告)日：2019-07-30

申请号：US15726760

申请日：2017-10-06

Applicant: Bose Corporation

Inventor： Benjamin E. Zelnick ,  Bennett P. Daley ,  Daniel P. Baker

IPC: H04R1/10 ,  H04R5/033

Abstract: Various implementations include headphone systems. In one implementation, a headphone system includes: a pair of earcups; a continuous headband spring connecting the pair of earcups, the continuous headband spring having an internal slot with an opening along an inner surface thereof; and an adjustment apparatus coupled with one of the pair of earcups and the continuous headband spring, the adjustment apparatus having: a shoe coupled with the one of the pair of earcups and positioned in the internal slot; a tongue coupled with the shoe and extending at least partially along the continuous headband spring; and a resistance member coupled with the tongue for resisting movement of the tongue relative to the continuous headband spring.

公开(公告)号：US10582292B2

公开(公告)日：2020-03-03

申请号：US15726764

申请日：2017-10-06

Applicant: Bose Corporation

Inventor： Daniel P. Baker ,  Christopher A Barnes

IPC: H04R1/10 ,  H04R5/033 ,  G06F3/044

Abstract: Various implementations include printed circuit board mounts and related headphone systems employing such mounts. In one implementation, a mount for a printed circuit board (PCB) includes: a plate for matingly engaging an inner portion of a headphone earcup, the plate including at least one PCB mount for coupling with the PCB; and a coupling element extending from the plate and including at least one coupler for coupling the plate proximate to a spine extending through the inner portion of the headphone earcup.

公开(公告)号：US10484772B2

公开(公告)日：2019-11-19

申请号：US15782910

申请日：2017-10-13

Applicant: BOSE CORPORATION

Inventor： Johnpaul P. Barrieau ,  Richard L. Pyatt ,  Jonathan D. Turner ,  Daniel P. Baker

IPC: H04R1/02 ,  H04R1/10

Abstract: Aspects of the present disclosure provide an intentional leak from a rear volume of an ear cup to the atmosphere. The leak is created via a vent in the driver plate acoustic assembly. The vent reduces an acoustic load the ear cup cover creates on a rear cavity of an electroacoustic transducer contained within the driver plate acoustic assembly of a headset. Additionally, the vent is hidden on an assembled ear cup of a headset. Due to the placement of the vent, ear cup cover may have a smooth, seamless surface.

公开(公告)号：US20190110122A1

公开(公告)日：2019-04-11

申请号：US15726760

申请日：2017-10-06

Applicant: Bose Corporation

Inventor： Benjamin E. Zelnick ,  Bennett P. Daley ,  Daniel P. Baker

IPC: H04R1/10

CPC classification number: H04R1/1066 ,  H04R1/1008 ,  H04R1/105 ,  H04R5/0335

Abstract: Various implementations include headphone systems. In one implementation, a headphone system includes: a pair of earcups; a continuous headband spring connecting the pair of earcups, the continuous headband spring having an internal slot with an opening along an inner surface thereof; and an adjustment apparatus coupled with one of the pair of earcups and the continuous headband spring, the adjustment apparatus having: a shoe coupled with the one of the pair of earcups and positioned in the internal slot; a tongue coupled with the shoe and extending at least partially along the continuous headband spring; and a resistance member coupled with the tongue for resisting movement of the tongue relative to the continuous headband spring.

公开(公告)号：US12294823B2

公开(公告)日：2025-05-06

申请号：US17881792

申请日：2022-08-05

Applicant: Bose Corporation

Inventor： Allen T. Graff ,  Daniel C. Haferman ,  Zhen Xu ,  Daniel P. Baker

IPC: H04R1/10

Abstract: Headphones include a cushion assembly and a slider telescopically coupled to the cushion assembly. The slider includes a proximal end that is disposed within the cushion assembly and a distal end extending outward from the cushion assembly. A pivot mount is disposed within an opening at the distal end of the slider. A pivot is supported in the pivot mount. The headphones also include an earphone and a yoke that couples the earphone to the slider. The pivot mount is secured to the slider via a fastener, and wherein the yoke is pivotable to a position in which it covers the fastener when the headphones are in use.

公开(公告)号：US20240048886A1

公开(公告)日：2024-02-08

申请号：US17881835

申请日：2022-08-05

Applicant: Bose Corporation

Inventor： Allen T. Graff ,  Daniel C. Haferman ,  Zhen Xu ,  Daniel P. Baker

IPC: H04R1/10

CPC classification number: H04R1/1008 ,  H04R1/1075 ,  H04R1/1066

Abstract: A headphone includes a cushion assembly, a slider telescopingly received within the cushion assembly, and an earphone. A yoke couples the earphone to the slider. A pivot is disposed at an open end of the slider and couples the yoke to the slider. The pivot includes a barrel that is received within an opening in the yoke. The barrel is secured within the opening via a pin that is inserted into a hole in the yoke.

公开(公告)号：US10812893B2

公开(公告)日：2020-10-20

申请号：US16118739

申请日：2018-08-31

Applicant: Bose Corporation

Inventor： Ryan Joseph Wexler ,  Daniel P. Baker

IPC: H04R1/10

Abstract: Various implementations include an arm for a napeband-style earphone system and a related earphone system. The arm has sections with distinct stiffness in order to flex over the top of a user's pinna for placement of an earphone proximate the ear.