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公开(公告)号:US20230038278A1
公开(公告)日:2023-02-09
申请号:US17815733
申请日:2022-07-28
Applicant: BRIGHAM YOUNG UNIVERSITY
Inventor: Henry Davis , Brian Jensen , Nathan B. Crane , Robert C. Davis , James Harkness , Isa Kohls , Richard Vanfleet
Abstract: Embodiments disclosed are systems and methods for interfacing a metallic capillary in a microchannel of a metallic body. A method may include inserting a portion of the metallic capillary into a portion the microchannel of the metallic body, sintering the portion of the metallic capillary to the portion of the microchannel of the metallic body, disposing a sacrificial powder at least proximate to the metallic capillary and the metallic body after sintering the portion of the metallic capillary and the portion of the microchannel of the metallic body, and infiltrating at least the portion of the metallic capillary sintered to the portion of the microchannel of the metallic body with an infiltrant in the presence of the sacrificial powder disposed at least proximate to the metallic capillary and the metallic body.
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公开(公告)号:US20230042108A1
公开(公告)日:2023-02-09
申请号:US17815743
申请日:2022-07-28
Applicant: BRIGHAM YOUNG UNIVERSITY
Inventor: Henry Davis , Brian Jensen , Nathan B. Crane , Robert C. Davis , James Harkness , Isa Kohls , Richard Vanfleet
Abstract: Embodiments disclosed are systems and methods for fabricating microchannels in metal. In an embodiments, a method includes providing a first metallic plate having a first surface with an elongated slot recessed therein, providing a second metallic plate having a second surface, interfacing the first surface of the first metallic plate with the second surface of the second metallic plate with the second surface covering the elongated slot to form a microchannel between the first metallic plate and the second metallic plate, thermal bonding the first metallic plate to the second metallic plate to form a metallic body having the microchannel extending therethrough, and infiltrating the metallic body with an infiltrant.
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