公开(公告)号：US12053900B2

公开(公告)日：2024-08-06

申请号：US17702966

申请日：2022-03-24

申请人： BROTHER KOGYO KABUSHIKI KAISHA

发明人： Yasuhito Shikama ,  Naoya Sakai ,  Kentaro Sugiyama

IPC分类号： B26F1/38 ,  B26D7/01 ,  B26D7/26 ,  B26D7/00

CPC分类号： B26F1/3813 ,  B26D7/015 ,  B26D7/2628 ,  B26D2007/0087 ,  B26D2007/2678

摘要： A cutting device includes a platen, a mounting portion, a movement mechanism, a processor, and a memory. The memory is configured to store computer-readable instructions that, when executed by the processor, instruct the processor to perform processes including acquiring a hardness-correspondence value corresponding to a hardness of a cutting object placed on the platen, acquiring cutting data for cutting a pattern from the cutting object, setting, based on the hardness-correspondence value, an offset amount used for a rotation correction to a greater value when the hardness of the cutting object is hard than when the hardness of the cutting object is soft, correcting, using the set offset amount, data, of the cutting data, corresponding to a direction change section, and performing cutting processing to cut the cutting object using a cutting blade, by controlling the movement mechanism in accordance with the corrected cutting data.