公开(公告)号：US20250065430A1

公开(公告)日：2025-02-27

申请号：US18724846

申请日：2022-11-16

Applicant: BS TECHNICS Co., Ltd.

Inventor： Jun Sik KIM ,  Young Do KIM ,  Jung Sik CHOI ,  Tae Kyoung JUNG ,  Seung Ho KIM ,  In Ho PARK

IPC: B23K1/002 ,  B23K3/047 ,  B23K3/08 ,  B23K101/36

Abstract: The present invention relates to induction-heated soldering automation equipment and, particularly, to equipment comprising: a jig unit for fixing a substrate on which an electronic element is mounted; a first conveyor for transferring the jig unit; an induction heating unit which is provided above the jig unit so as to be movable in the X-axis, Y-axis, and Z-axis directions, and which includes a magnetic induction coil for soldering the electronic element by induction-heating the substrate fixed to the jig unit; and a controller for controlling the first conveyor and the induction heating unit, wherein continuously supplied molded interconnected devices (MIDs), PCBs, or FPCBs are locally heated through contactless induction heating so that electronic elements can be automatically soldered in a state in which thermal damage is minimized.