公开(公告)号：US3849947A

公开(公告)日：1974-11-26

申请号：US37964673

申请日：1973-07-16

Applicant: BUNKER RAMO

Inventor： BUNKOCZY B

IPC: B24B1/00 ,  B24B19/22

CPC classification number: B24B1/00 ,  B24B19/226

Abstract: A method of squaring one or more elements, such as the print wires of a wire matrix print head, with a surface of a member in which the elements are mounted. The elements are of a material having a predetermined hardness which is less than the hardness of the material of the surface in which they are mounted. The first step of the method is to adjust the position of all of the elements relative to the surface so that they extend slightly from the surface. The extending portions of the elements are then ground with an element having an abrasive surface, the material of the abrasive surface having a hardness which is greater than the predetermined hardness but less than the hardness of the material for the surface in which the elements are mounted. The grinding step is terminated when the material of the abrasive surface starts being worn away by the harder material of the surface in which the elements are mounted.

Abstract translation: 将一个或多个元件（例如线阵列打印头的打印线）与其中安装元件的部件的表面平方的方法。 这些元件是具有小于其安装表面的材料的硬度的预定硬度的材料。 该方法的第一步是调整所有元件相对于表面的位置，使它们从表面稍微延伸。 然后，元件的延伸部分用具有研磨表面的元件研磨，研磨表面的材料具有大于预定硬度但小于其中元件安装表面的材料的硬度 。 当研磨表面的材料开始被安装元件的表面的较硬材料磨损时，研磨步骤终止。