公开(公告)号：US20180317342A1

公开(公告)日：2018-11-01

申请号：US15769589

申请日：2016-10-28

Applicant: BYD COMPANY LIMITED

Inventor： Qing GONG ,  Yaxuan SUN ,  Xinping LIN ,  Shuming ZHAO ,  Bo WU ,  Jingjing LUO ,  Donghai CHENG

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20254 ,  H01L23/3677 ,  H01L23/473 ,  H01L25/07 ,  H01L29/7393

Abstract: A base plate for a heat sink as well as a heat sink and an IGBT module having the same are provided. The base plate includes: a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part; and N pins disposed on the first surface layer and spaced apart from one another, each pin having a first end fixed on the first surface layer and a second end configured as a free end, in which the first surface layer and the N pins are configured to contact a coolant, an area of a first portion of the first surface layer contacting the coolant is denoted as S1, and an area of a second portion of the first surface layer contacting each pin is denoted as S2, in which 180≤S1/S2≤800, and 300≤N