公开(公告)号：US20170292021A1

公开(公告)日：2017-10-12

申请号：US15631440

申请日：2017-06-23

Applicant: BYD COMPANY LIMITED

Inventor： XIONG ZHANG ,  JIANJUN WEN ,  ZHENGSHENG ZHAO ,  WEI ZHOU ,  QING GONG

IPC: C08L81/04 ,  C08L67/00 ,  B29C45/00 ,  C08K7/02 ,  B32B7/04 ,  B32B7/14 ,  C08L63/08 ,  C08L71/00

CPC classification number: C08L81/04 ,  B29C45/0046 ,  B29C45/14 ,  B32B7/04 ,  B32B7/14 ,  C08K7/02 ,  C08L63/08 ,  C08L67/00 ,  C08L67/02 ,  C08L71/00 ,  C08L81/02

Abstract: A resin composition, a metal-resin composite formed with the resin composition and a metal substrate and a preparation method and use thereof, and an electronic product shell using the resin composition are provided. The resin composition comprises a base resin, a modified resin and a fiber, wherein the base resin is one or two or more of a polyarylene sulfide resin, a polyether resin, and a polyester resin, and the modified resin has a melting point that is 3-24° C. higher than a glass transition temperature of the base resin.