公开(公告)号：US20120140101A1

公开(公告)日：2012-06-07

申请号：US13338756

申请日：2011-12-28

Applicant: Bahram AFSHARI ,  John Toor ,  Samuel Wennyann Ho

Inventor： Bahram AFSHARI ,  John Toor ,  Samuel Wennyann Ho

IPC: H04N5/335 ,  H04N5/225

CPC classification number: H04N5/2257

Abstract: A wafer level camera module can be easily connected to a host device via mounting surface contacts. The module includes an electrically controllable active optical element and a flexible printed circuit that provides electrical connection between the optical element and surface conductors on a mounting surface of the module. The surface conductors can be a group of solder balls, and the module can have another group of solder balls that make connection to another electrical component of the module, such as an image sensor. All of the solder balls can be coplanar in a predetermined grid pattern, and all of the components of the device can be surrounded by a housing such that the camera module is an easily mounted ball grid array type package.

Abstract translation: 晶片级相机模块可以通过安装表面触点轻松连接到主机设备。 该模块包括电可控有源光学元件和柔性印刷电路，其在模块的安装表面上的光学元件和表面导体之间提供电连接。 表面导体可以是一组焊球，并且该模块可以具有另一组焊球，其与诸如图像传感器的模块的另一电气部件连接。 所有的焊球可以以预定的格栅图案共面，并且装置的所有部件都可以被壳体包围，使得相机模块是容易安装的球栅阵列型封装。