Abstract:
An electrically controllable optical lens apparatus makes use of fixed lenses and an active optical element together in a lens enclosure. The enclosure may be a barrel structure that is easily mounted to a camera device having an image sensor. The active optical element, such as a tunable liquid crystal lens, receives an electrical signal from the camera device via electrical conductors integral with the lens enclosure that provide electrical pathways between the active element on the interior of the enclosure and surface contacts on the camera device. The enclosure may be a two-piece structure, and the electrical conductors may be attached to either piece of the structure. The lens enclosure may also be threaded for attachment to the camera device. The electrical conductors may also use spring loaded contact portions or molded interconnect devices.
Abstract:
A focus free camera module uses fixed lenses within a housing that are combined with an electrically controllable active optical element, such as a tunable liquid crystal lens. The fixed lenses provide a desired amount of optical power, but the manufacturing tolerances of the module are insufficient to ensure a proper focus of an image on an image sensor. The active optical element is therefore used to compensate for any variations in the optical power to achieve the desired focus. To ensure an effective compensation, the module may be constructed so that, when the variation in optical power due to manufacturing tolerances is at a maximum, the desired focus is achieved when the active optical element is at zero optical power. All other variations may then be compensated by adjusting the active optical element to increase its optical power.
Abstract:
A wafer level camera module can be easily connected to a host device via mounting surface contacts. The module includes an electrically controllable active optical element and a flexible printed circuit that provides electrical connection between the optical element and surface conductors on a mounting surface of the module. The surface conductors can be a group of solder balls, and the module can have another group of solder balls that make connection to another electrical component of the module, such as an image sensor. All of the solder balls can be coplanar in a predetermined grid pattern, and all of the components of the device can be surrounded by a housing such that the camera module is an easily mounted ball grid array type package.
Abstract:
A wafer level camera module can be easily connected to a host device via mounting surface contacts. The module includes an electrically controllable active optical element and a flexible printed circuit that provides electrical connection between the optical element and surface conductors on a mounting surface of the module. The surface conductors can be a group of solder balls, and the module can have another group of solder balls that make connection to another electrical component of the module, such as an image sensor. All of the solder balls can be coplanar in a predetermined grid pattern, and all of the components of the device can be surrounded by a housing such that the camera module is an easily mounted ball grid array type package.
Abstract:
An electrically controllable optical lens apparatus makes use of fixed lenses and an active optical element together in a lens enclosure. The enclosure may be a barrel structure that is easily mounted to a camera device having an image sensor. The active optical element, such as a tunable liquid crystal lens, receives an electrical signal from the camera device via electrical conductors integral with the lens enclosure that provide electrical pathways between the active element on the interior of the enclosure and surface contacts on the camera device. The enclosure may be a two-piece structure, and the electrical conductors may be attached to either piece of the structure. The lens enclosure may also be threaded for attachment to the camera device. The electrical conductors may also use spring loaded contact portions or molded interconnect devices.
Abstract:
An improved apparatus for and method of attaching a peripheral electronic component to an electronic system uses spring-urged protrusions to attach the peripheral electronic component to the electronic system without screws or other traditional hardware fasteners. Preferably, the spring-urged protrusions are configured to allow quick and easy installation and removal without the need for tools. Further, the apparatus is preferably configured to use standard mounting holes included in most peripheral electronic components. Therefore, the apparatus does not require costly custom modification for use with a variety of peripheral electronic components. More particularly, the apparatus is preferably electrically conductive to ground the chassis of the peripheral electronic component to the electronic system. In addition, the apparatus uses the spring-urged protrusions to reduce or eliminate the transmission of vibration between the peripheral electronic component and the electronic system. The apparatus preferably includes a manually operable mechanism for releasing the spring-urged protrusions to allow quick removal of the peripheral electronic component from the electronic system without the use of tools.
Abstract:
A method and apparatus for mounting a motherboard to a chassis of a personal computer using only a single screw. A number of standoffs snap into the base of the chassis, electrically contacting the chassis. Each standoff includes a projection. The motherboard includes apertures for accepting the projections such that when an ramp and shelf of each projection is aligned with the motherboard, the motherboard is positioned a fixed distance from the chassis. A mounting bracket also includes a number of projections. Apertures provided in the motherboard correspond to the projections of the mounting bracket. The surface of each side of the motherboard surrounding each aperture is plated with an electrically conductive material to form a conductive path between the motherboard and the standoffs and the bracket. The projections of the bracket are inserted into the corresponding apertures in the motherboard. A screw is inserted through a wall of the chassis and into a threaded hole in the bracket. As the screw is tightened, the bracket is drawn toward the wall of the chassis. This firmly engages the motherboard to the stand-offs and to the bracket, firmly maintaining the motherboard in a fixed position relative to the chassis and forming a solid electrical ground connection between the motherboard and the chassis. Also, as the screw is tightened, input and output connectors, which are coupled to the motherboard, are drawn toward the wall of the chassis making firm contact with a plate or gasket.
Abstract:
A tele wide module includes a first optics group, a fixed position for the first optics group, a second optics group, a set of predetermined positions for the second optics group, a selector for selecting a first position from the set of predetermined positions, and an image sensor. The first optics group is configured to provide a focus to the image sensor. The focus is based on the selected first position. A method of adjusting a lens configuration selects a first position from a set of positions. Based on the selected position, the method deposes a second lens group in relation to a first lens group. Typically, the position of the first lens group is fixed. Through the first and second lens groups, the method provides an image to an image sensor. The method of some embodiments provides a focused image to the image sensor by using a hyper focal setting.
Abstract:
An optical module includes a first optics group, a second optics group, and an image sensor, wherein the first optics group and second optics group are configured to provide an image having a focus and a magnification to the image sensor. In some embodiments of the present invention, a first optics assembly includes a first optics group coupled to a threaded portion of a first lead screw so that translation of the first lead screw results in translation of the first optics group along an axis of the first lead screw, a first actuator for rotating the first lead screw; and a first sensing target configured to permit detection of rotation of the first lead screw. In some embodiments of the present invention a second optics assembly includes a second optics group coupled to a threaded portion of a second lead screw so that translation of the second lead screw results in translation of the second optics group along an axis of the second lead screw, a second actuator for rotating the second lead screw, and second means for sensing configured to detect rotation of the second lead screw.