PLASMA MODIFICATION OF ADHESIVE AND SUBSTRATE SURFACES FOR USE IN ADHESIVE JOINT APPLICATIONS

    公开(公告)号:US20250051613A1

    公开(公告)日:2025-02-13

    申请号:US18797019

    申请日:2024-08-07

    Abstract: Methods for producing adhesive joints through the application of plasma treatment of both substrates and adhesives are disclosed. The methods involve plasma treating the substrate surfaces to enhance their surface energy and promote better adhesion. The adhesive—whether in the form of an adhesive strip or a flowable adhesive—is also subjected to plasma treatment. This dual treatment results in adhesive joints with enhanced lap shear strength and resistance to debonding. The enhanced performance of the adhesive joints is attributed to the increased intra-molecular bonding at the substrate/adhesive interfaces, enabled by the plasma treatments.

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