SPEAKER MODULE AND HEADSET
    1.
    发明公开

    公开(公告)号:US20240080610A1

    公开(公告)日:2024-03-07

    申请号:US18272934

    申请日:2022-08-25

    CPC classification number: H04R1/24 H04R1/1016 H04R1/1075 H04R9/06

    Abstract: A speaker module and a headset (100) are provided. The speaker module is used for the headset (100). The headset (100) includes a housing (1). The speaker module includes a first speaker unit (4a) and a second speaker unit (4b). An outer surface of a first diaphragm assembly (4a21) of the first speaker unit (4a) faces a first side, the second speaker unit (4b) is located on one side of a circumferential direction of the first speaker unit (4a), the second speaker unit (4b) emits sound toward the first side, and sound emission frequency of the second speaker unit (4b) is greater than sound emission frequency of the first speaker unit (4a).

    CORE, SPEAKER MODULE, AND ELECTRONIC DEVICE
    2.
    发明公开

    公开(公告)号:US20240323613A1

    公开(公告)日:2024-09-26

    申请号:US18574540

    申请日:2022-01-18

    Inventor: Jinhua LIU

    Abstract: This application relates to the technical field of electronic devices, and provides a core, a speaker module, and an electronic device, to balance thinning and audio performance of the device. The core includes a diaphragm assembly, a first voice coil set, a second voice coil set, and a magnetic circuit system. The first voice coil set and the second voice coil set are fastened to the diaphragm assembly. The magnetic circuit system includes a magnet assembly. The magnet assembly includes a first central magnet, a second central magnet, and a side magnet. A magnetization direction of the second central magnet is the same as a magnetization direction of the first central magnet. The core provided in embodiments of this application is configured to convert an audio electrical signal into sound.

Patent Agency Ranking