公开(公告)号：US20200169096A1

公开(公告)日：2020-05-28

申请号：US16746440

申请日：2020-01-17

Applicant: Bell Helicopter Textron Inc.

Inventor： Gary S. Froman

IPC: H02J7/00 ,  G01R31/50 ,  G01R31/00 ,  B64D45/02 ,  H02J7/34 ,  H02H5/10 ,  B64D43/00 ,  H05F1/00 ,  H02H1/00 ,  H02H3/04

Abstract: In one embodiment, an aircraft electronics system includes a hardware processor, a charge collection circuit to collect charge; a switching circuit controlled by the hardware processor to discharge the charge collected on the charge collection circuit through a bonding circuit formed from a chassis and a bonding surface; and a voltage measurement circuit to measure a voltage difference between measurement terminals across the chassis and the bonding surface.

公开(公告)号：US10574066B2

公开(公告)日：2020-02-25

申请号：US15830875

申请日：2017-12-04

Applicant: Bell Helicopter Textron Inc.

Inventor： Gary S. Froman

IPC: G01R27/26 ,  H02J7/00 ,  G01R31/02 ,  B64D45/02 ,  H02H5/10 ,  B64D43/00 ,  G01R31/00 ,  H02J7/34 ,  H02H1/00 ,  H02H3/04 ,  H05F1/00

Abstract: In one embodiment, an aircraft electronics system includes a hardware processor, a charge collection circuit to collect charge; a switching circuit controlled by the hardware processor to discharge the charge collected on the charge collection circuit through a bonding circuit formed from a chassis and a bonding surface; and a voltage measurement circuit to measure a voltage difference between measurement terminals across the chassis and the bonding surface.

公开(公告)号：US10442539B2

公开(公告)日：2019-10-15

申请号：US15594360

申请日：2017-05-12

Applicant: Bell Helicopter Textron Inc.

Inventor： Gary S. Froman

IPC: B64D15/12 ,  H05B1/02 ,  H05B3/34 ,  B64D15/20 ,  B64C11/20 ,  B64C29/00

Abstract: In one embodiment, a system may comprise an electro-thermal heating element and a controller. The electro-thermal heating element may be configured to heat a structure, and the controller may be configured to: identify a target temperature for the structure; identify a target rate of temperature change for the structure; identify a target voltage for heating the structure at the target rate of temperature change; and apply the target voltage to the electro-thermal heating element.

公开(公告)号：US20190173296A1

公开(公告)日：2019-06-06

申请号：US15830875

申请日：2017-12-04

Applicant: Bell Helicopter Textron Inc.

Inventor： Gary S. Froman

IPC: H02J7/00 ,  H02J7/34 ,  G01R31/00 ,  B64D43/00

Abstract: In one embodiment, an aircraft electronics system includes a hardware processor, a charge collection circuit to collect charge; a switching circuit controlled by the hardware processor to discharge the charge collected on the charge collection circuit through a bonding circuit formed from a chassis and a bonding surface; and a voltage measurement circuit to measure a voltage difference between measurement terminals across the chassis and the bonding surface.

公开(公告)号：US20180327100A1

公开(公告)日：2018-11-15

申请号：US15594360

申请日：2017-05-12

Applicant: Bell Helicopter Textron Inc.

Inventor： Gary S. Froman

IPC: B64D15/12 ,  H05B1/02 ,  H05B3/34 ,  B64C19/00

CPC classification number: B64D15/12 ,  B64C11/20 ,  B64C29/0033 ,  B64D15/20 ,  H05B1/0236 ,  H05B3/34 ,  H05B2214/02

Abstract: In one embodiment, a system may comprise an electro-thermal heating element and a controller. The electro-thermal heating element may be configured to heat a structure, and the controller may be configured to: identify a target temperature for the structure; identify a target rate of temperature change for the structure; identify a target voltage for heating the structure at the target rate of temperature change; and apply the target voltage to the electro-thermal heating element.