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公开(公告)号:US20130104365A1
公开(公告)日:2013-05-02
申请号:US13477919
申请日:2012-05-22
IPC分类号: B23P17/04
CPC分类号: H05K1/165 , H01F41/0253 , H01F41/14 , H05K2201/086 , H05K2201/09854 , Y10T29/4902 , Y10T29/49075 , Y10T29/49826 , Y10T29/49833
摘要: A method of embedding a magnetic component in a substrate is disclosed. Holes are formed in a substrate by mechanically drilling. Each of the holes includes a top opening, a bottom and sidewall, wherein an area of the top opening is larger than that of the bottom. The sidewall extends from the top opening vertically downwards to a predetermined depth, and then is slanted inwardly to the bottom to form a sloped sidewall at the bottom of the hole. A predetermined region is defined along a portion of an edge of the top opening, and a portion of the substrate material under the predetermined region is removed by routing to form a component accommodation trench with a portion of the sloped sidewall at the bottom. Then, a magnetic component is placed into the component accommodation trench.
摘要翻译: 公开了一种在基板中嵌入磁性部件的方法。 通过机械钻孔在基板中形成孔。 每个孔包括顶部开口,底部和侧壁,其中顶部开口的区域大于底部开口的面积。 侧壁从顶部开口垂直向下延伸到预定深度,然后向内倾斜到底部,以在孔的底部形成倾斜的侧壁。 沿着顶部开口的边缘的一部分限定预定区域,并且通过布线移除在该预定区域下方的基底材料的一部分,以形成部分容纳沟槽,其中倾斜侧壁的一部分位于底部。 然后,将磁性部件放置在部件容纳沟槽中。