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1.发明授权公开(公告)号：US12035516B2
公开(公告)日：2024-07-09
申请号：US17469930
申请日：2021-09-09
Inventor： Jae Do Nam , Ui Seok Hwang , Na Yeon Kim , In Kyung Park
CPC classification number: H05K9/0081 , H05K1/036 , H05K9/0075 , H05K2201/086
Abstract: Disclosed are an electromagnetic interference shielding composite that selectively absorbs and shields an electromagnetic wave, and an electronic device using the same. The electromagnetic interference shielding composite includes a first composite layer, wherein the first composite layer includes: a matrix; and reflective particles and absorbent particles dispersed in the matrix, wherein the reflective particles reflect an electromagnetic wave, wherein the absorbent particles absorb the electromagnetic wave and convert the absorbed electromagnetic wave to heat energy and emit the heat energy.
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公开(公告)号：US20230371177A1
公开(公告)日：2023-11-16
申请号：US17741429
申请日：2022-05-10
Applicant: International Business Machines Corporation
Inventor： Yuan Yao , Todd Edward Takken
CPC classification number: H05K1/115 , H05K1/165 , H05K3/429 , H01F17/0013 , H01F27/255 , H01F27/2804 , H05K2201/086 , H01F2027/2809
Abstract: A circuit board including: a first board material layer having a first planar surface and a first sidewall surface perpendicular to the first planar surface; a first conductive layer on the first planar surface; a second board material layer stacked on the first board material layer and having a second planar surface and a second sidewall surface perpendicular to the second planar surface; a second conductive layer on the second planar surface; and a plating on the first sidewall surface and the second sidewall surface and electrically connecting the first conductive layer and the second conductive layer.
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公开(公告)号：US11764686B1
公开(公告)日：2023-09-19
申请号：US17580206
申请日：2022-01-20
Applicant: Vicor Corporation
Inventor： Patrizio Vinciarelli
IPC: H01H47/00 , H02M3/335 , H05K1/18 , H05K1/02 , H05K1/16 , H05K3/02 , H01F27/28 , H01F41/04 , H02M3/337 , H02M1/44 , H01F1/44 , H01F3/10 , H05K3/00 , H02M1/00
CPC classification number: H02M3/33523 , H01F1/44 , H01F3/10 , H01F27/2804 , H01F41/041 , H02M1/44 , H02M3/3376 , H02M3/33561 , H02M3/33592 , H05K1/0298 , H05K1/165 , H05K1/181 , H05K3/0011 , H05K3/02 , H01F1/447 , H01F2003/106 , H01F2027/2809 , H01F2027/2819 , H02M1/008 , H02M1/0058 , H05K1/0204 , H05K1/0265 , H05K2201/08 , H05K2201/086
Abstract: A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.
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4.发明公开公开(公告)号：US20230155513A1
公开(公告)日：2023-05-18
申请号：US17419715
申请日：2021-02-10
Applicant: INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
Inventor： Yanbo ZOU , Fada DU , Chao TANG , Wenjie LIN
CPC classification number: H02M3/33576 , H01F27/2804 , H02M3/003 , H05K1/18 , H05K1/165 , H05K3/30 , H01F2027/2819 , H05K2201/086 , H05K2201/0723
Abstract: The present invention provides a high efficiency, high density GaN-based power converter comprising: a transformer; a magnetic coupler; a primary switch; a secondary switch; a primary controller; a secondary controller; a multi-layered print circuit board (PCB) comprising: one or more planar coils respectively formed on one or more PCB layers and aligned with each other for constructing the transformer and the coupler; and a plurality of conducting traces and vias for providing electrical connection among the transformer, the coupler, a primary switch, a secondary switch, a primary controller and a secondary controller. The power converter further comprises a pair of ferrite cores being fixed to a top surface and a bottom surface of the PCB respectively and commonly shared by the transformer and the coupler.
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公开(公告)号：US20190199232A1
公开(公告)日：2019-06-27
申请号：US16289758
申请日：2019-03-01
Applicant: Delta Electronics (Shanghai) CO., LTD
Inventor： Jianhong ZENG , Xiaoni XIN
IPC: H02M7/00 , H02M3/335 , H05K1/11 , H05K7/06 , H05K7/02 , H05K1/18 , H05K1/14 , H01F27/40 , H05K1/02 , H01F27/24 , H05K1/16 , H01F27/28 , H02M7/04
CPC classification number: H02M7/003 , H01F27/24 , H01F27/28 , H01F27/2804 , H01F27/306 , H01F27/40 , H01F2027/408 , H02M3/33576 , H02M7/04 , H02M2001/0048 , H05K1/0203 , H05K1/0254 , H05K1/111 , H05K1/115 , H05K1/142 , H05K1/145 , H05K1/165 , H05K1/181 , H05K1/182 , H05K7/026 , H05K7/06 , H05K2201/086 , H05K2201/10015 , H05K2201/1003 , H05K2201/10166 , H05K2201/10174 , Y02B70/1491
Abstract: A converter module includes: a system board; and an isolated rectifier unit connected with the system board via at least one pin, the isolated rectifier unit including: a system board; a circuit module; and an isolated rectifier unit arranged adjacent to the circuit module and connected with the system board; wherein the isolated rectifier unit includes: a magnetic core comprising at least one core column parallel to the system board and two cover plates provided at both ends of the core column; and multiple carrier board units provided between the two cover plates and perpendicular to the system board, wherein each of the carrier board units comprises at least one via hole, at least one primary winding, at least one secondary winding and at least one switch connected with the at least one secondary winding.
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Patent Agency Ranking
公开(公告)号：US20190139694A1
公开(公告)日：2019-05-09
申请号：US15803474
申请日：2017-11-03
Applicant: AJOHO ENTERPRISE CO., LTD.
Inventor： Chia-Ping MO , You-Chi LIU
IPC: H01F27/29 , H05K3/00 , H01F41/04 , H01F17/00 , H01F27/28 , H05K1/02 , H01F27/24 , H01F17/06 , B29C33/16
CPC classification number: H01F27/292 , B29C33/16 , H01F17/0013 , H01F17/06 , H01F27/24 , H01F27/2804 , H01F27/2847 , H01F27/30 , H01F41/0246 , H01F41/043 , H01F41/046 , H01F2017/0066 , H01F2027/2819 , H05K1/0233 , H05K3/007 , H05K2201/086
Abstract: A magnetic device fabrication method includes the step of using molds to respectively process a first substrate and a second substrate into respective predetermined shapes, the step of forming conductors in shaped protruding blocks of the first substrate and conducting contacts in the second substrate, the step of attaching one or more magnetic cores to the first plate member to couple one or more positioning slots to the protruding blocks of the first plate member respectively and the step of bonding one or multiple magnetic cores between the first and second substrate to provide a continuous winding type induction coil effect, saving much manufacturing labor and time.
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公开(公告)号：US20180308829A1
公开(公告)日：2018-10-25
申请号：US16021026
申请日：2018-06-28
Applicant: CYNTEC CO., LTD.
Inventor： Chi-Feng Huang , Bau-Ru Lu , Da-Jung Chen
CPC classification number: H01L25/16 , H05K1/181 , H05K1/188 , H05K3/284 , H05K3/3405 , H05K3/3421 , H05K2201/086 , H05K2201/1003 , H05K2201/10166 , H05K2201/10515 , H05K2203/0415
Abstract: A stacked electronic structure comprises: a substrate and a magnetic device, wherein a plurality of electronic devices and a plurality of conductive pillars are disposed on and electrically connected to the substrate, wherein a molding body encapsulates the plurality of electronic devices, wherein the magnetic device is disposed over the top surface of the molding body and the plurality of conductive pillars, wherein a first terminal of the magnetic device is disposed over and electrically connected to a first conductive pillar and a second terminal of the magnetic device is disposed over and electrically connected to a second conductive pillar, without using any substrate.
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公开(公告)号：US10063098B2
公开(公告)日：2018-08-28
申请号：US15399742
申请日：2017-01-06
Applicant: CYNTEC CO., LTD.
Inventor： Huei-Ren You , Bau-Ru Lu , Kaipeng Chiang
IPC: H05K1/18 , H02J50/10 , H01F27/24 , H01F27/29 , H05K1/02 , H05K1/11 , H01F17/04 , H05K3/36 , H05K1/14
CPC classification number: H02J50/10 , H01F17/04 , H01F27/24 , H01F27/29 , H01F27/292 , H01F2017/048 , H05K1/0203 , H05K1/0262 , H05K1/117 , H05K1/141 , H05K1/184 , H05K3/366 , H05K2201/044 , H05K2201/066 , H05K2201/086 , H05K2201/1003 , H05K2201/10545
Abstract: An electronic module is provided. The electronic module comprises an inductor having a magnetic body with a coil encapsulated in the magnetic body and a substrate having electronic devices thereon, wherein a first electrode is disposed on a top surface of the magnetic body and a second electrode is disposed on a lateral surface of the magnetic body, wherein the top surface of the inductor and the bottom surface of the substrate are configured side by side and electrically connected to each other, wherein a plurality of third electrodes are disposed on a lateral surface of the substrate, for electrically connecting the electronic module to an external circuit board.
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公开(公告)号：US20180174737A1
公开(公告)日：2018-06-21
申请号：US15846140
申请日：2017-12-18
Applicant: Delta Electronics (Shanghai) Co.,Ltd.
Inventor： Haibin Song , Zengyi Lu , Jinfa Zhang , Shiwei Liu , Jian Zhou , Daofei Xu , Jianwei Song
CPC classification number: H01F27/2804 , H01F27/24 , H01F2027/2819 , H01F2027/408 , H05K1/0298 , H05K1/115 , H05K1/165 , H05K3/46 , H05K2201/086 , H05K2201/09672
Abstract: The present disclosure discloses a PCB winding transformer and a coil board thereof. The PCB winding transformer comprises a coil board and a magnetic core. The coil board includes a primary coil and a secondary coil. The primary coil and the secondary coil are wound around a magnetic core column of the magnetic core. At least two via holes which correspond to the primary coil and the secondary coil respectively are disposed in the coil board. In the primary coil and the secondary coil, the via hole corresponding to the coil with less turns is disposed between an inner side of the coil with more turns and the magnetic core column.
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公开(公告)号：US20180151951A1
公开(公告)日：2018-05-31
申请号：US15881857
申请日：2018-01-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuo IKEMOTO , Jun SASAKI
CPC classification number: H01Q1/52 , H01Q1/22 , H01Q1/38 , H01Q1/40 , H01Q3/02 , H01Q7/06 , H05K1/028 , H05K1/115 , H05K1/117 , H05K1/147 , H05K1/165 , H05K1/181 , H05K3/06 , H05K3/4635 , H05K3/4652 , H05K3/4691 , H05K2201/086 , H05K2201/10098 , H05K2201/10189 , H05K2201/2009
Abstract: A multilayer substrate, in which flexible insulating base materials are laminated, includes first and second regions. The number of laminated insulating base materials in the second region is smaller than that in the first region. The multilayer substrate includes a coil antenna located in the first region, a magnetic member located in the first region, a mounting component located in the first region, a wiring pattern, and an external connection terminal. The mounting component entirely overlaps the magnetic member when viewed in a thickness direction and is located on a side opposite to the coil antenna across the magnetic member in the thickness direction. At least a portion of the coil antenna overlaps the magnetic member when viewed in the thickness direction.
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