OPEN-EAR HEADPHONE
    3.
    发明公开
    OPEN-EAR HEADPHONE 审中-公开

    公开(公告)号:US20230269519A1

    公开(公告)日:2023-08-24

    申请号:US18142268

    申请日:2023-05-02

    申请人: Bose Corporation

    IPC分类号: H04R1/10

    摘要: A flexible arm that is configured to be located between and physically and electrically connect an acoustic module of an open-ear headphone to a battery housing of the open-ear headphone. The flexible arm defines an original resting length and position between the acoustic module and the battery housing. The flexible arm includes a flexible printed circuit that extends through the entire original resting length of the flexible arm and comprises a conductor that is configured to carry electrical energy between the acoustic module and the battery housing. A first interface structure is coupled to one of the acoustic module and the battery housing. A flexible material encases at least some of the flexible printed circuit and at least some of the first interface structure.

    Open-ear headphone
    4.
    发明授权

    公开(公告)号:US11683631B1

    公开(公告)日:2023-06-20

    申请号:US17590509

    申请日:2022-02-01

    申请人: Bose Corporation

    IPC分类号: H04R1/10

    摘要: A flexible arm that is configured to be located between and physically and electrically connect an acoustic module of an open-ear headphone to a battery housing of the open-ear headphone. The flexible arm defines an original resting length and position between the acoustic module and the battery housing. The flexible arm includes a flexible printed circuit that extends through the entire original resting length of the flexible arm and comprises a conductor that is configured to carry electrical energy between the acoustic module and the battery housing. A first interface structure is coupled to one of the acoustic module and the battery housing. A flexible material encases at least some of the flexible printed circuit and at least some of the first interface structure.