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公开(公告)号:US11268001B2
公开(公告)日:2022-03-08
申请号:US15958126
申请日:2018-04-20
申请人: Bostik, Inc.
IPC分类号: C09J175/04 , C08G18/48 , C08G18/76 , C08G65/336 , C09J171/00 , C09J171/02 , C09J175/08 , E04F21/20 , E04F21/16 , E04F15/02 , C08K7/00 , E04F15/04
摘要: An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight percent of a moisture curable polymer system; and 40 to 90 weight percent of additives for modifying physical properties of the composition. The adhesive has a composition such that, when cured, results in an elastomeric film of uniform thickness that exhibits controlled moisture vapor transmission and sound abatement properties. A floor structure and a method for constructing the floor structure using the adhesive composition are also provided.
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公开(公告)号:US20180237670A1
公开(公告)日:2018-08-23
申请号:US15958126
申请日:2018-04-20
申请人: Bostik, Inc.
IPC分类号: C09J175/04 , C09J175/08 , C09J171/02 , C08G18/48 , C08G18/76 , E04F15/02 , C08G65/336 , E04F21/20 , E04F21/16 , C09J171/00 , E04F15/04 , C08K7/00
CPC分类号: C09J175/04 , C08G18/4825 , C08G18/4829 , C08G18/7671 , C08G65/336 , C08K7/00 , C09J171/00 , C09J171/02 , C09J175/08 , E04F15/02155 , E04F15/04 , E04F21/162 , E04F21/20 , Y10T428/25
摘要: An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight percent of a moisture curable polymer system; and 40 to 90 weight percent of additives for modifying physical properties of the composition. The adhesive has a composition such that, when cured, results in an elastomeric film of uniform thickness that exhibits controlled moisture vapor transmission and sound abatement properties. A floor structure and a method for constructing the floor structure using the adhesive composition are also provided.
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