System, method and apparatus for fiber bonding procedure for optoelectronic packaging
    2.
    发明授权
    System, method and apparatus for fiber bonding procedure for optoelectronic packaging 失效
    用于光电子封装的光纤粘合程序的系统,方法和装置

    公开(公告)号:US06874948B2

    公开(公告)日:2005-04-05

    申请号:US10077530

    申请日:2002-02-14

    摘要: A method and apparatus for bonding optical fibers are disclosed. A fiber bonding device feeds an optical fiber through a supportive sheath having a ceramic tip at its end. The optical fiber extends slightly beyond the ceramic tip and is aligned with the focal point of a laser, which causes the end of the optical fiber to melt, forming a molten region. The ceramic tip then extends partially into a substrate surface, causing the molten region of the optical fiber to become bonded to the substrate. The process is controlled by computer logic, such that it is an automated, precision process for bonding optical fibers.

    摘要翻译: 公开了一种用于粘合光纤的方法和装置。 光纤接合装置通过其端部具有陶瓷尖端的支撑护套馈送光纤。 光纤稍微延伸超过陶瓷尖端并与激光器的焦点对准,这导致光纤的端部熔化,形成熔融区域。 陶瓷尖端然后部分地延伸到衬底表面中,使得光纤的熔融区域结合到衬底上。 该过程由计算机逻辑控制,使得它是用于粘合光纤的自动化的精密工艺。