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公开(公告)号:US20090277681A1
公开(公告)日:2009-11-12
申请号:US12419171
申请日:2009-04-06
CPC分类号: H05K7/186 , H04Q1/068 , H04Q1/10 , H04Q1/131 , Y10T29/4913
摘要: An expansion cross-connect enclosure is disclosed. The expansion cross-connect enclosure includes a housing having a front, a rear, a top, a bottom, and left and right sides, the housing having a doorway at the front. The expansion cross-connect enclosure also includes a cross-connect panel detachably connected within the housing at the rear of the housing, and an access door covering the doorway, the access door pivotally connected across the front by a door hinge. The expansion cross-connect enclosure further includes cable access openings through the rear of the housing positioned to be aligned with horizontal cable access openings of an existing cross-connect enclosure.
摘要翻译: 公开了一种扩展交叉连接外壳。 扩展交叉连接外壳包括具有前部,后部,顶部,底部以及左侧和右侧的壳体,所述壳体在前部具有门口。 扩展交叉连接外壳还包括可拆卸地连接在壳体的壳体后部的交叉连接面板和覆盖门口的通道门,通道门通过门铰链横跨前部枢转地连接。 扩展交叉连接外壳还包括通过壳体后部的电缆接入开口,其被定位成与现有交叉连接外壳的水平电缆接入开口对准。
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公开(公告)号:US07195521B2
公开(公告)日:2007-03-27
申请号:US11033991
申请日:2005-01-11
IPC分类号: H01R24/04
CPC分类号: H04Q1/021 , H04M19/00 , H04Q1/06 , H04Q2201/08 , H04Q2201/10 , H04Q2201/12
摘要: A DSX jack module having removable jacks is disclosed. The jack module includes a jack mount for holding the jacks. The jack module also includes a front facing cross-connect array and a front facing IN/OUT array. A circuit board is electrically connected to the arrays. The circuit board includes portions positioned directly behind the cross-connect array and the IN/OUT array. A chassis for holding jack modules is also disclosed. The chassis includes a front door having a double hinge configuration.
摘要翻译: 公开了具有可拆卸插孔的DSX插座模块。 插座模块包括用于保持插座的插座。 插座模块还包括前面的交叉连接阵列和面向前的IN / OUT阵列。 电路板电连接到阵列。 电路板包括直接位于交叉连接阵列后面的部分和IN / OUT阵列。 还公开了用于保持插座模块的底盘。 底盘包括具有双铰链构造的前门。
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公开(公告)号:US07044803B2
公开(公告)日:2006-05-16
申请号:US10894866
申请日:2004-07-20
申请人: Scott K. Baker , Bruce R. Musolf , James Dewey , Jeffrey L. Peters , Thomas Good
发明人: Scott K. Baker , Bruce R. Musolf , James Dewey , Jeffrey L. Peters , Thomas Good
IPC分类号: H01R24/04
CPC分类号: H01R13/70 , H01R13/514 , H01R13/518 , H04Q1/13 , H04Q2201/10 , H04Q2201/802
摘要: A patching system is disclosed herein. The patching system includes a plurality of front-loaded patching modules positionable within a chassis. Each of the patching modules includes first and second longframe jack assemblies and a switch for changing the circuit configurations of the patching module. The patching modules and the chassis provide increased patching density.
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公开(公告)号:US06840815B2
公开(公告)日:2005-01-11
申请号:US09967316
申请日:2001-09-28
CPC分类号: H04Q1/021 , H04M19/00 , H04Q1/06 , H04Q2201/08 , H04Q2201/10 , H04Q2201/12
摘要: A DSX jack module having removable jacks is disclosed. The jack module includes a jack mount for holding the jacks. The jack module also includes a front facing cross-connect array and a front facing IN/OUT array. A circuit board is electrically connected to the arrays. The circuit board includes portions positioned directly behind the cross-connect array and the IN/OUT array. A chassis for holding jack modules is also disclosed. The chassis includes a front door having a double hinge configuration.
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