公开(公告)号：US20200269279A1

公开(公告)日：2020-08-27

申请号：US16683750

申请日：2019-11-14

Applicant: Butterfly Network, Inc.

Inventor： Lingyun Miao ,  Jianwei Liu ,  Keith G. Fife

IPC: B06B1/02 ,  B81B3/00 ,  B81C1/00

Abstract: A method of forming an ultrasonic transducer device includes forming and patterning a film stack over a substrate, the film stack comprising a metal electrode layer and a chemical mechanical polishing (CMP) stop layer formed over the metal electrode layer; forming an insulation layer over the patterned film stack; planarizing the insulation layer to the CMP stop layer; measuring a remaining thickness of the CMP stop layer; and forming a membrane support layer over the patterned film stack, wherein the membrane support layer is formed at thickness dependent upon the measured remaining thickness of the CMP stop layer, such that a combined thickness of the CMP stop layer and the membrane support layer corresponds to a desired transducer cavity depth.

公开(公告)号：US20200147641A1

公开(公告)日：2020-05-14

申请号：US16680956

申请日：2019-11-12

Applicant: Butterfly Network, Inc.

Inventor： Keith G. Fife ,  Lingyun Miao ,  Jianwei Liu ,  Jonathan M. Rothberg

IPC: B06B1/02 ,  B81B7/00 ,  B81C1/00 ,  A61B8/00

Abstract: A method of forming an ultrasonic transducer device includes bonding a membrane to seal a transducer cavity with at least a portion of a getter material layer being exposed, the getter material layer comprising a portion of a bilayer stack compatible for use in damascene processing.

公开(公告)号：US20200254487A1

公开(公告)日：2020-08-13

申请号：US16784186

申请日：2020-02-06

Applicant: Butterfly Network, Inc.

Inventor： Lingyun Miao ,  Jianwei Liu ,  Jonathan M. Rothberg

IPC: B06B1/06 ,  A61B8/12 ,  A61B8/00

Abstract: A method of forming an ultrasonic transducer device includes forming a patterned metal electrode layer over a substrate, the patterned metal electrode layer comprising a lower layer and an upper layer formed on the lower layer; forming an insulation layer over the patterned metal electrode layer; and planarizing the insulation layer to the upper layer of the patterned metal electrode layer, wherein the upper layer comprises a electrically conductive material that serves as a chemical mechanical polishing (CMP) stop layer that has CMP selectivity with respect to the insulation layer and the lower layer, and wherein the upper layer has a CMP removal rate slower than that of the insulation layer.

公开(公告)号：US20210038193A1

公开(公告)日：2021-02-11

申请号：US16988125

申请日：2020-08-07

Applicant: Butterfly Network, Inc.

Inventor： Jianwei Liu ,  Lingyun Miao ,  Sarp Satir

IPC: A61B8/00 ,  B06B1/06 ,  H04R31/00

Abstract: An ultrasonic transducer device is provided. In some embodiments, the ultrasonic transducer device includes a substrate having a membrane support layer formed on a bottom cavity layer, and an opening in the membrane support layer so as to form a transducer cavity. In some embodiments, the opening comprises a truncated circle shape.