Abstract:
A display device includes a display panel, a driving chip, and a non-conductive adhesive film. The display panel includes a pad member having a plurality of conductive pads. The driving chip includes a body and a plurality of bumps. The body has a driving circuit. The bumps are protruded from the body to make contact with the pads, respectively. The non-conductive adhesive film fixes the driving chip to the pad member. Therefore, a manufacturing cost is decreased, and a yield is increased.
Abstract:
A display device includes a display panel, a driving chip, and a non-conductive adhesive film. The display panel includes a pad member having a plurality of conductive pads. The driving chip includes a body and a plurality of bumps. The body has a driving circuit. The bumps are protruded from the body to make contact with the pads, respectively. The non-conductive adhesive film fixes the driving chip to the pad member. Therefore, a manufacturing cost is decreased, and a yield is increased.
Abstract:
A jig for manufacturing a display device is provided. In one embodiment, the jig includes a first hinge part for rotating a working plate to which a backlight assembly is fixed, and a second hinge part for rotating a cover to fix the backlight assembly to the working plate. A method of manufacturing a display device using the jig includes loading the backlight assembly on the working plate of the jig, installing a main panel on a main part of the backlight assembly, rotating the cover to fix the backlight assembly to the working plate, rotating the working plate, and installing a sub panel on a sub part of the backlight assembly. In various embodiments, use of the jig can provide improvements in assembly efficiency, reduced numbers of product defects, and improved production in the manufacture of display devices.