摘要:
In a flat panel display apparatus having improved sealing and a method of manufacturing the same, the flat panel display apparatus comprises: a substrate; a display unit disposed on the substrate; a sealing substrate facing the display unit; a sealing member interposed between the substrate and the sealing substrate and surrounding the display unit; and a plurality of wiring groups comprising areas overlapping the sealing member between the substrate and the sealing substrate; wherein the wiring groups are disposed so as to surround the display unit, are spaced apart from an area corresponding to an edge of the display unit, and receive voltage from an external power source.
摘要:
An organic light emitting diode (OLED) display includes a first substrate; a second substrate disposed to face the first substrate, an OLED disposed between the first and second substrates, and a sealant disposed between the first substrate and the second substrate. The organic light emitting diode emits light. The sealant seals a space between the first substrate and the second substrate. The organic light emitting diode is enclosed by the sealant and is spaced apart from the sealant by a predetermined gap. The OLED display further includes a scattering portion positioned at a seal area that covers the predetermined gap. The scattering portion scatters light incident into the scattering portion.
摘要:
An organic light-emitting display device comprises a substrate including a plurality of light-emitting regions separated by a non-light-emitting region, an organic light-emitting element disposed on each of the light-emitting regions, and a photoactive element disposed on the non-light-emitting region.
摘要:
A display device may include a first substrate comprising a display region and a non-display region surrounding the display region, a first metal wiring formed in the display region of the first substrate, a second metal wiring formed in the non-display region of the first substrate, a sealing member formed on the second metal wiring, and a second substrate disposed on the sealing member so as to face the first substrate. The first metal wiring and the second wiring are made of the same material.
摘要:
Flat panel displays and methods of manufacturing the displays are disclosed. In one embodiment, the flat panel display includes: i) a substrate, ii) a display unit formed over the substrate, iii) an encapsulation substrate formed so as to face the display unit and iv) a sealing member formed between the substrate and the encapsulation substrate so as to substantially surround the display unit. The display may further include i) a wiring unit formed between the substrate and the encapsulation substrate so as to substantially overlap with the sealing member, wherein the wiring unit includes at least one via hole and ii) an inlet unit connected to the wiring unit and connectable to an external power source.
摘要:
A flat panel display apparatus includes a first substrate having a display region, a second substrate facing the first substrate and bonded to the first substrate, a groove portion in an edge of at least one of the first substrate and the second substrate, and a wiring portion and a bonding member arranged in the groove portion. The bonding member contacts the wiring portion. The wiring portion is configured to receive power and to supply heat to the bonding member. The bonding member is configured to bond the first substrate and the second substrate using the heat supplied from the wiring portion disposed in the groove portion.
摘要:
A mother substrate for forming flat panel display apparatuses and a method of manufacturing the same, the mother substrate including a substrate; a plurality of display units on the substrate, the display units being for forming a plurality of flat panel display apparatuses; a sealing substrate facing the display units; sealing members between the substrate and the sealing substrate, the sealing members surrounding each of the display units; a plurality of wiring units between the substrate and the sealing substrate, the wiring units overlapping the sealing members; a connecting unit including a conductive material, the connecting unit connecting adjacent wiring units in one direction and having a width that is greater than a width of each of the wiring units; and inlets connected to the plurality of wiring units and an external power source, the inlets being for applying a voltage to the plurality of wiring units.
摘要:
An organic light emitting diode (OLED) display includes: a first substrate including an OLED; a second substrate that is opposite to the first substrate; a sealant that is positioned between the first substrate and the second substrate and that couples the first substrate and the second substrate; and a sealant contraction reinforcement auxiliary structure that is positioned in at least one of a position between the first substrate and the sealant and a position between the second substrate and the sealant.
摘要:
A flat panel display apparatus includes a first substrate having a display region, a second substrate facing the first substrate and bonded to the first substrate, a groove portion in an edge of at least one of the first substrate and the second substrate, and a wiring portion and a bonding member arranged in the groove portion. The bonding member contacts the wiring portion. The wiring portion is configured to receive power and to supply heat to the bonding member. The bonding member is configured to bond the first substrate and the second substrate using the heat supplied from the wiring portion disposed in the groove portion.
摘要:
An organic light emitting display apparatus includes a first substrate including a display region disposed in a center of one surface thereof and a bonding region formed along a closed loop to surround the display region; a semiconductor layer corresponding to the bonding region of the first substrate, formed along the closed loop to surround the display region, and comprising a polycrystal; at least one insulation layer formed over the semiconductor layer; a bonding member formed over the at least one insulation layer and formed in a region corresponding to the semiconductor layer; and a second substrate having the one surface disposed to face one surface of the first substrate and coupled to the bonding member to encapsulate the display region of the first substrate.