公开(公告)号：US20240176033A1

公开(公告)日：2024-05-30

申请号：US18511903

申请日：2023-11-16

申请人： CANON KABUSHIKI KAISHA

发明人： TAKAAKI GONDA ,  TOMOHIRO HOSHINA ,  AKIRA KIDA ,  KAITO MIYASHITA

IPC分类号： G01T1/20 ,  G01T1/17

CPC分类号： G01T1/2019 ,  G01T1/17

摘要： A radiation imaging apparatus includes a radiation detector, a control circuit board, a support base, a wiring circuit board, and a first shield member. The radiation detector detects radiation and the control circuit board controls the radiation detector. The support base has a first surface and a second surface opposite to the first surface and holds the radiation detector on the first surface and the control circuit board on the second surface. The wiring circuit board connects the radiation detector and the control circuit board to each other at a side surface of the support base. The wiring circuit board has a surface-mount component mounted on the wiring circuit board. The first shield member blocks the radiation and disposed between the surface-mount component and the support base.

公开(公告)号：US20240142644A1

公开(公告)日：2024-05-02

申请号：US18473565

申请日：2023-09-25

申请人： CANON KABUSHIKI KAISHA

发明人： TOMOHIRO HOSHINA ,  MASATO INOUE ,  KAITO MIYASHITA

IPC分类号： G01T1/24

CPC分类号： G01T1/243 ,  G01T1/241 ,  G01T1/247

摘要： A radiation detection apparatus includes a plurality of sensor units each including a semiconductor layer that converts radiation into a charge, a first surface located on a radiation incident side, and a second surface located on an opposite side to the first surface, a support member, an elastic member located between the second surface of each of the plurality of sensor units and the support member, and a substrate that covers the first surface of each of the plurality of sensor units. The elastic member presses each of the plurality of sensor units toward the substrate.

公开(公告)号：US20240142642A1

公开(公告)日：2024-05-02

申请号：US18493611

申请日：2023-10-24

申请人： CANON KABUSHIKI KAISHA

发明人： AKIRA KIDA ,  TAKAAKI GONDA ,  TOMOHIRO HOSHINA ,  KAITO MIYASHITA

IPC分类号： G01T1/20

CPC分类号： G01T1/20182

摘要： A radiation imaging apparatus includes a radiation detection sensor, a support base, a bonding member, and a wiring member. The radiation detection sensor is configured to detect radiation and is formed using a flexible substrate. The support base supports radiation detection sensor. The bonding member bonds a first region of the radiation detection sensor to the support base. The first region is located in a central portion of the radiation detection sensor. The wiring member is connected to a predetermined edge portion of the radiation detection sensor. A second region is a region of the radiation detection sensor that includes the predetermined edge portion, and the second region opposes the support base but is not adhered to the support base.