公开(公告)号：US20230030043A1

公开(公告)日：2023-02-02

申请号：US17872999

申请日：2022-07-25

Applicant: CANON KABUSHIKI KAISHA

Inventor： Souta Takeuchi ,  Masaya Uyama

IPC: B41J2/14 ,  B41J2/16

Abstract: A highly reliable liquid ejection head comprises a substrate made of silicon and having a first surface and a second surface opposite to the first surface, an ejection port forming member bonded to the first surface of the substrate and formed with an ejection port for ejecting liquid, and a bonded member configured to be bonded to the second surface of the substrate. A through flow path is formed in the substrate, which is configured to pass through the substrate and to supply liquid to the ejection port. A first protective film made of a metal oxide is formed on an inner surface of the through flow path, and a second protective film made of a silicon compound is formed on all of the second surface of the substrate.

公开(公告)号：US11518170B2

公开(公告)日：2022-12-06

申请号：US16842329

申请日：2020-04-07

Applicant: CANON KABUSHIKI KAISHA

Inventor： Mitsunori Toshishige ,  Souta Takeuchi

IPC: B41J2/16 ,  B41J2/14

Abstract: A method of manufacturing a liquid discharge head includes preparing a first substrate where a discharge port configured to discharge liquid is formed to face a first surface, a concave portion is formed on a side of a second surface opposite to the first surface, and a first liquid flow passage penetrating from the first surface to the second surface is opened inside the concave portion on the side of the second surface, preparing a second substrate including a second liquid flow passage opened on a third surface, and sticking the first substrate and the second substrate to communicate the first liquid flow passage with the second liquid flow passage by bonding a bottom face of the concave portion and the third surface with an adhesive agent.

公开(公告)号：US11081349B2

公开(公告)日：2021-08-03

申请号：US16268901

申请日：2019-02-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Masaya Uyama ,  Souta Takeuchi ,  Taichi Yonemoto ,  Kazuaki Shibata ,  Atsushi Teranishi ,  Takeru Yasuda ,  Atsunori Terasaki

IPC: H01L21/00 ,  H01L21/027 ,  H01L21/02

Abstract: Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.

公开(公告)号：US10933635B2

公开(公告)日：2021-03-02

申请号：US16701996

申请日：2019-12-03

Applicant: CANON KABUSHIKI KAISHA

Inventor： Souta Takeuchi ,  Takeru Yasuda ,  Kazuaki Shibata ,  Taichi Yonemoto

IPC: B41J2/14 ,  B41J2/16

Abstract: Provided is a liquid ejection head substrate including: a substrate; a liquid ejection element that generates liquid ejection energy on the substrate; and an electrode pad that is electrically connected to the liquid ejection element, in which the electrode pad includes a barrier metal layer and a bonding layer on the barrier metal layer, and an end side surface of the barrier metal layer is covered with a silicon-based film containing carbon.

公开(公告)号：US20200338892A1

公开(公告)日：2020-10-29

申请号：US16842329

申请日：2020-04-07

Applicant: CANON KABUSHIKI KAISHA

Inventor： Mitsunori Toshishige ,  Souta Takeuchi

IPC: B41J2/16 ,  B41J2/14

Abstract: A method of manufacturing a liquid discharge head includes preparing a first substrate where a discharge port configured to discharge liquid is formed to face a first surface, a concave portion is formed on a side of a second surface opposite to the first surface, and a first liquid flow passage penetrating from the first surface to the second surface is opened inside the concave portion on the side of the second surface, preparing a second substrate including a second liquid flow passage opened on a third surface, and sticking the first substrate and the second substrate to communicate the first liquid flow passage with the second liquid flow passage by bonding a bottom face of the concave portion and the third surface with an adhesive agent.

公开(公告)号：US20200001605A1

公开(公告)日：2020-01-02

申请号：US16452336

申请日：2019-06-25

Applicant: CANON KABUSHIKI KAISHA

Inventor： Masaya Uyama ,  Takuya Hatsui ,  Souta Takeuchi ,  Masataka Kato ,  Toru Nakakubo ,  Tomohiro Takahashi

IPC: B41J2/14 ,  H01L23/00

Abstract: A semiconductor element includes an insulation layer and a pad portion for electrical connection to an external portion by wire bonding. The insulation layer includes a plurality of projections projecting from a main surface of the insulation layer. The pad portion is disposed on an upper surface of each of the projections without extending beyond the upper surface of the projection on which the pad portion is formed.

公开(公告)号：US20200001604A1

公开(公告)日：2020-01-02

申请号：US16452162

申请日：2019-06-25

Applicant: CANON KABUSHIKI KAISHA

Inventor： Souta Takeuchi ,  Takuya Hatsui ,  Masataka Kato ,  Masaya Uyama ,  Toru Nakakubo ,  Tomohiro Takahashi

IPC: B41J2/14

Abstract: A liquid ejection head includes an ejection port member that includes an ejection port that ejects a liquid, an energy generating element that generates energy for ejecting the liquid from the ejection port, a terminal electrically connected to the energy generating element, and a substrate portion that supports the ejection port member, the energy generating element, and the terminal. The terminal is connected to a wire member that supplies electric power that drives the energy generating element to the energy generating element, the substrate portion includes a hole portion formed from a surface of the substrate portion on a side opposite to a surface of the substrate portion on which the terminal is provided to a surface where the terminal is exposed, and an area of the surface where the terminal is exposed is smaller than an area of an opening of the hole portion.

公开(公告)号：US09975338B2

公开(公告)日：2018-05-22

申请号：US15217354

申请日：2016-07-22

Applicant: CANON KABUSHIKI KAISHA

Inventor： Takuya Hatsui ,  Shuichi Tamatsukuri ,  Souta Takeuchi ,  Kenji Takahashi ,  Soichiro Nagamochi ,  Shinya Iwahashi

IPC: B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1631 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1642 ,  Y10T29/49401

Abstract: A method for manufacturing a liquid ejection head substrate, in which a heat storage layer, a pair of electrodes extending from the surface of the heat storage layer toward the back surface, a heat-generating resistor layer in contact with the pair of electrodes and the surface of the heat storage layer, and a first cover layer configured to cover the heat-generating resistor layer are stacked, includes the steps of etching the heat-generating resistor layer and the first cover layer by using a mask disposed on a substrate including the heat-generating resistor layer and the first cover layer, removing the mask, and forming a second cover layer configured to cover an end portion of the heat-generating resistor layer in that order.

公开(公告)号：US20200227252A1

公开(公告)日：2020-07-16

申请号：US16268901

申请日：2019-02-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Masaya Uyama ,  Souta Takeuchi ,  Taichi Yonemoto ,  Kazuaki Shibata ,  Atsushi Teranishi ,  Takeru Yasuda ,  Atsunori Terasaki

IPC: H01L21/027 ,  H01L21/02

Abstract: Provided is a method of forming a film on a substrate including: forming a protective member on a surface of the substrate; forming an organic structure on the surface of the substrate, at a distance from the protective member; removing the protective member after the formation of the organic structure; and forming a film by CVD in a region of the surface of the substrate from which the protective member is removed.

公开(公告)号：US20190217619A1

公开(公告)日：2019-07-18

申请号：US16239863

申请日：2019-01-04

Applicant: CANON KABUSHIKI KAISHA

Inventor： Souta Takeuchi ,  Soichiro Nagamochi ,  Takuya Hatsui

IPC: B41J2/16 ,  B41J2/14

Abstract: A liquid ejection head including a substrate, an energy generating element provided on the substrate, a film provided on the substrate and the energy generating element, and a flow path forming member provided on the substrate, forming a flow path of a liquid between the flow path forming member and the substrate, and having an ejection orifice at a position faced with the energy generating element, characterized in that the substrate has a supply path of the liquid communicating with the flow path, the flow path forming member has a structure protruding toward the supply path, and a peripheral shape of a distal end portion of the structure is a curved surface shape.