SENSOR BOARD, RADIATION IMAGING APPARATUS, RADIATION IMAGING SYSTEM, AND METHOD OF MANUFACTURING SENSOR BOARD

    公开(公告)号:US20230258834A1

    公开(公告)日:2023-08-17

    申请号:US18163432

    申请日:2023-02-02

    CPC classification number: G01T3/06

    Abstract: A sensor board comprising a substrate comprising a pixel region where pixels are arranged on a first surface of two surfaces, a scintillator arranged on one of the first surface and a second surface of the two surfaces and a light shielding member arranged on the surface on which the scintillator is arranged, is provided. The pixel region comprises a first region where a signal for radiation image is generated and a second region where a signal for correcting a signal output from the first region is generated. The scintillator is arranged to overlap the first region but not to overlap the second region. The light shielding member is arranged to cover the scintillator and overlap the second region. A portion of the light shielding member overlapping the second region is bonded to the surface on which the scintillator is arranged.

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