ELECTRONIC DEVICE INCLUDING A GUEST MATERIAL WITHIN A LAYER AND A PROCESS FOR FORMING THE SAME
    1.
    发明申请
    ELECTRONIC DEVICE INCLUDING A GUEST MATERIAL WITHIN A LAYER AND A PROCESS FOR FORMING THE SAME 失效
    包括层中的顾客材料的电子设备及其形成方法

    公开(公告)号:US20070278501A1

    公开(公告)日:2007-12-06

    申请号:US11840367

    申请日:2007-08-17

    IPC分类号: H01L31/12

    摘要: An electronic device made by a process that includes forming a first layer over a substrate and placing a first liquid composition over a first portion of the first layer. The first liquid composition includes at least a first guest material and a first liquid medium. The first liquid composition comes in contact with the first layer and a substantial amount of the first guest material intermixes with the first layer. An electronic device includes a substrate and a continuous first layer overlying the substrate. The continuous layer includes a first portion in which an electronic component lies and a second portion where no electronic component lies. The first portion is at least 30 nm thick and includes a first guest material, and the second portion is no more than 40 nm thick.

    摘要翻译: 一种通过包括在基底上形成第一层并将第一液体组合物放置在第一层的第一部分上的方法制造的电子器件。 第一液体组合物包括至少第一客体材料和第一液体介质。 第一液体组合物与第一层接触并且大量的第一客体材料与第一层混合。 电子器件包括衬底和覆盖衬底的连续的第一层。 连续层包括电子部件所在的第一部分和没有电子部件所在的第二部分。 第一部分为至少30nm厚,并且包括第一客体材料,并且第二部分不超过40nm厚。