摘要:
A housing for an electronic device includes a thin film defining an outer surface having a plurality of impressions, and an inner surface positioned opposite to the outer surface, a decorative coating attached to the inner surface of the thin film; and a substrate attached to the decorative coating. A method for manufacturing the housing and an electronic device using the housing are also disclosed.
摘要:
A housing for an electronic device comprises a thin film defining concave portions thereon; a decorative pattern having a mirror-effect formed in the concave portions; and a substrate attached to the decorative pattern and the thin film. A method for manufacturing the housing and an electronic device using the housing are also disclosed.
摘要:
A housing includes a thin film comprising transparent plastic and color particles, a protecting film attached to the thin film; and a substrate attached to the protecting film. A method for manufacturing the housing and an electronic device using the housing are also disclosed.
摘要:
A housing includes a substrate, a decorative layer attached to the substrate, a first transparent plastic film covering the decorative layer, a second transparent plastic film attached to the first transparent plastic film, and a flexible paint layer coated on the second transparent plastic film.
摘要:
A mold (20) for making a housing includes a female mold (22) and a rotatable male mold (24). The female mold has a first recessed mold portion (221) and a second recessed mold portion (222) defined therein. The male mold includes a first mold core (242), a second mold core (244), and a movable compression assembly (246). The first mold core has a first stepped portion (2422) and a second stepped portion (2424) protruding from the first stepped portion. The second mold core has a projection wall (2441) protruding from the male mold and a molding groove (2442) defined by the projection wall. The projection wall is matingly engageable into any one of the first recessed mold portion and the second recessed mold portion. The movable compression assembly is received in the molding groove and capable of moving towards to the female mold.
摘要:
A cover for a mobile device includes a substrate with a surface including a patterned surface portion and a non-patterned surface portion. An ink coating is formed on the patterned surface portion of the substrate. A metal coating system is electroplated on the non-patterned surface portion of the substrate. The ink coating is recessed relative to the metal coating system.