公开(公告)号：US20120273162A1

公开(公告)日：2012-11-01

申请号：US13452292

申请日：2012-04-20

Applicant: CHETAN MAHADESWARASWAMY

Inventor： CHETAN MAHADESWARASWAMY

IPC: F25B29/00

CPC classification number: H01L21/67109 ,  H01J37/3244 ,  H01J37/32522 ,  H01L23/34 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods for cooling process chamber components are provided herein. In some embodiments, a method of cooling a process chamber component may include reducing a power provided to a heater disposed proximate a surface of the process chamber component to reduce an amount of heat provided to the component by the heater; providing a coolant to coolant channels disposed within the process chamber component using a pulsed flow having a duty cycle until the process chamber component reaches a temperature that is less than or equal to a predetermined magnitude above a temperature of the coolant; and after the process chamber component reaches the temperature less than or equal to the predetermined magnitude above a temperature of the coolant, reducing the duty cycle of the pulsed flow of the coolant to zero.

Abstract translation: 本文提供了冷却处理室部件的方法。 在一些实施例中，冷却处理室部件的方法可以包括减小设置在处理室部件表面附近的加热器的功率，以减少由加热器提供给部件的热量; 使用具有占空比的脉冲流将冷却剂提供给设置在处理室部件内的冷却剂通道，直到处理室部件达到小于或等于超过冷却剂温度的预定大小的温度; 并且在处理室部件达到小于或等于超过冷却剂温度的预定大小的温度时，将冷却剂的脉冲流量的占空比减小到零。