公开(公告)号：US10153261B2

公开(公告)日：2018-12-11

申请号：US15477942

申请日：2017-04-03

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Baris Dogruoz ,  Vic Chia ,  M. Onder Cap

IPC: H01L23/34 ,  H01L25/18 ,  H01L23/427 ,  H01L23/367

Abstract: The subject disclosure relates to an integrated circuit package having an application specific integrated circuit, a high bandwidth memory, a first heat sink having a first footprint and a first path, and a second heat sink having a second footprint and a second path, wherein the second footprint does not exceed the first footprint. The thermal energy through the first path travels from the application specific integrated circuit to the first heat sink and thermal energy through the second path travel from the high bandwidth memory through one or more heat pipes to the second heat sink.

公开(公告)号：US20180286844A1

公开(公告)日：2018-10-04

申请号：US15477942

申请日：2017-04-03

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Baris Dogruoz ,  Vic Chia ,  M. Onder Cap

IPC: H01L25/18 ,  H01L23/427 ,  H01L23/367

CPC classification number: H01L25/18 ,  H01L23/36 ,  H01L23/427

Abstract: The subject disclosure relates to an integrated circuit package having an application specific integrated circuit, a high bandwidth memory, a first heat sink having a first footprint and a first path, and a second heat sink having a second footprint and a second path, wherein the second footprint does not exceed the first footprint. The thermal energy through the first path travels from the application specific integrated circuit to the first heat sink and thermal energy through the second path travel from the high bandwidth memory through one or more heat pipes to the second heat sink.