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    HIGH IMPACT RESISTANT HEAT SINK
    1.
    发明申请
    HIGH IMPACT RESISTANT HEAT SINK 审中-公开

    公开(公告)号：US20200328136A1

    公开(公告)日：2020-10-15

    申请号：US16913663

    申请日：2020-06-26

    Applicant: Cisco Technology, Inc.

    Inventor： Vic Chia ,  Hong Huynh ,  Steven A. Hanssen ,  Robert Gregory Twiss

    IPC: H01L23/40 ,  F16B5/02

    Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

    High impact resistant heat sink
    2.
    发明授权
    High impact resistant heat sink 有权

    公开(公告)号：US10109558B2

    公开(公告)日：2018-10-23

    申请号：US14740898

    申请日：2015-06-16

    Applicant: Cisco Technology, Inc.

    Inventor： Vic Chia ,  Hong Huynh ,  Steven A. Hanssen ,  Robert Gregory Twiss

    IPC: H01L23/40 ,  F16B5/02

    Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

    Bi-directional heatsink dampening force system
    5.
    发明授权
    Bi-directional heatsink dampening force system 有权

    公开(公告)号：US10903140B2

    公开(公告)日：2021-01-26

    申请号：US16384494

    申请日：2019-04-15

    Applicant: Cisco Technology, Inc.

    Inventor： Phil Slight ,  Vic Chia

    IPC: H05K7/20 ,  H01L23/40 ,  H05K1/02

    Abstract: A circuit board includes a heatsink configured to be coupled to the circuit board via a first coupling mechanism, the first coupling mechanism providing an asymmetrical downward force for coupling the heatsink to the circuit board. The circuit board further includes a second coupling mechanism configured to provide a counter force to the asymmetrical downward force of the first coupling mechanism. The counter force can be configured on an overhang portion of the heatsink that does not cover a circuit on the circuit board.

    Slot-filler blanking tray
    7.
    发明授权
    Slot-filler blanking tray 有权

    公开(公告)号：US09927852B2

    公开(公告)日：2018-03-27

    申请号：US14834455

    申请日：2015-08-25

    Applicant: Cisco Technology, Inc.

    Inventor： Vic Chia ,  Long Huu Dang ,  Hong Huynh

    IPC: G06F1/20 ,  H05K7/20 ,  A47B47/00 ,  G06F1/18 ,  H05K9/00

    CPC classification number: G06F1/20 ,  A47B47/0075 ,  G06F1/182 ,  G06F1/183 ,  H05K7/20563 ,  H05K9/0062

    Abstract: In one embodiment, a slot-filler blanking tray includes a vented blanking panel including a vented front panel, the vented blanking panel for fitting over an entrance to one slot of a computer equipment rack including support rails, and a panel arrangement including partition panels to form a slot partition for reversibly inserting into the one slot, supported by the support rails, the slot partition being formed either by unfolding the partition panels or fitting the partition panels together, wherein (a) the vented blanking panel and at least one partition panel of the partition panels are mechanically connected together, or (b) the vented blanking panel includes a first connecting element and the at least one partition panel includes a second connecting element to mechanically connect the vented blanking panel and the at least one partition panel together. Related apparatus and methods are also described.

    High Impact Resistant Heat Sink
    8.
    发明申请
    High Impact Resistant Heat Sink 审中-公开
    高耐冲击散热器

    公开(公告)号：US20160374232A1

    公开(公告)日：2016-12-22

    申请号：US14740898

    申请日：2015-06-16

    Applicant: Cisco Technology, Inc.

    Inventor： Vic Chia ,  Hong Huynh ,  Steven A. Hanssen ,  Robert Gregory Twiss

    IPC: H05K7/20

    CPC classification number: H01L23/4006 ,  F16B5/0266 ,  H01L2023/4081 ,  H01L2023/4087

    Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

    Abstract translation: 提供了散热器安装配置，其被配置为当线卡经受振动时，防止散热器损坏安装在印刷电路板（PCB）上的专用集成电路（ASIC）的球栅阵列（BGA），并且 冲击。 散热器安装配置可以包括一组螺钉，其被配置为至少部分地设置在散热器的孔内，以将散热器固定到PCB。 安装构造包括弹性构件和围绕靠近孔的螺钉周围的间隔件。 弹性构件构造成将散热器偏压在ASIC上以使散热器与ASIC接触。 间隔件构造成防止散热器在线卡受到振动和冲击时大到足以损坏BGA的力撞击ASIC。

    High impact resistant heat sink
    9.
    发明授权
    High impact resistant heat sink 有权

    公开(公告)号：US10734306B2

    公开(公告)日：2020-08-04

    申请号：US16137650

    申请日：2018-09-21

    Applicant: Cisco Technology, Inc.

    Inventor： Vic Chia ,  Hong Huynh ,  Steven A. Hanssen ,  Robert Gregory Twiss

    IPC: H01L23/40 ,  F16B5/02

    Abstract: A heat sink mounting configuration is provided that is configured to prevent the heat sink from damaging ball grid arrays (BGA) of an application specific integrated circuit (ASIC) mounted on a printed circuit board (PCB) when the line card is subjected to vibrations and shocks. The heat sink mounting configuration may include a set of screws configured to be at least partially disposed within the apertures of the heat sink to secure the heat sink to the PCB. The mounting configuration includes a resilient member and a spacer disposed around the screws proximate to the apertures. The resilient members are configured to bias the heat sink against the ASIC to maintain the heat sink in contact with the ASIC. The spacers are configured to prevent the heat sink from impacting the ASIC with forces large enough to damage the BGA when the line card is subjected to vibrations and shocks.

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