公开(公告)号：US11980005B2

公开(公告)日：2024-05-07

申请号：US17528379

申请日：2021-11-17

Applicant: Cisco Technology, Inc.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20154 ,  H05K1/0203 ,  H05K2201/066

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US11234342B2

公开(公告)日：2022-01-25

申请号：US16842505

申请日：2020-04-07

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US20210112682A1

公开(公告)日：2021-04-15

申请号：US16842505

申请日：2020-04-07

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US20240215196A1

公开(公告)日：2024-06-27

申请号：US18596926

申请日：2024-03-06

Applicant: Cisco Technology, Inc.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20154 ,  H05K1/0203 ,  H05K2201/066

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US20220078941A1

公开(公告)日：2022-03-10

申请号：US17528379

申请日：2021-11-17

Applicant: Cisco Technology, Inc.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.