PACKAGED ITEM INSPECTION DEVICE AND PACKAGED ITEM INSPECTION METHOD

    公开(公告)号:US20250100735A1

    公开(公告)日:2025-03-27

    申请号:US18976594

    申请日:2024-12-11

    Abstract: A packaged item inspection device includes: an illumination device that irradiates the packaged item with ultraviolet light; an imaging device that images the ultraviolet light reflected from the packaged item and obtains regular reflection light image data of the packaged item; and a hardware processor that determines whether the packaging material in the packaged item is defective or non-defective, based on the regular reflection light image data, depending on presence or absence of any tear or break in the packaging material. The hardware processor further processes the regular reflection light image data by a binarization process and thereby obtains binarized image data, and upon determining that an area of a connected region of a dark portion in the binarized image data is greater than a preset reference value, outputs a result of determination indicating that the packaging material is defective due to the presence of the tear or break.

    INSPECTION DEVICE
    2.
    发明公开
    INSPECTION DEVICE 审中-公开

    公开(公告)号:US20240337609A1

    公开(公告)日:2024-10-10

    申请号:US18748379

    申请日:2024-06-20

    Abstract: An inspection device includes: an illumination device that irradiates the inspection object with light; a rotation unit that rotates the inspection object; a fiber optical plate that holds optical fibers in parallel and has a light incident surface and a light emission surface at which outlets of the optical fibers are disposed; an imaging unit that includes sensor elements arranged in a row and respectively corresponding to the outlets, and takes an image of the inspection object; a control device that determines whether a quality of the inspection object is good or poor based on the image; and an oblique ray attenuation body that is disposed between the light emission surface and the imaging unit, and includes attenuation function elements arrayed in parallel and each having a straight cylindrical shape that surrounds an optical path between each of the outlets and each of the sensor elements.

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