公开(公告)号：US20220187027A1

公开(公告)日：2022-06-16

申请号：US17440812

申请日：2020-03-19

Applicant: CKD CORPORATION

Inventor： Akihiro ITO ,  Takahiro MINATANI ,  Shinichi NITTA

IPC: F28D20/02

Abstract: A heat exchange system is arranged between a chiller device and a temperature control member, and is provided with: supply line for supplying a refrigerant from the chiller device to the temperature control member; a return line for returning the refrigerant from the temperature control member to the chiller device; a bypass line for bypassing the supply line and the return line; a latent heat storage member arranged closer to the chiller device relative to a first connection point connecting the return line and the bypass line; and a flow distribution unit that is arranged at a second connection point connecting the outgoing line and the bypass line, and that is for adjusting a ratio for distributing refrigerant to the temperature control member and the bypass line.

公开(公告)号：US20210108737A1

公开(公告)日：2021-04-15

申请号：US17130731

申请日：2020-12-22

Applicant: CKD Corporation

Inventor： Akihiro ITO ,  Masayuki KOUKETSU ,  Keiichi NISHIKAWA ,  Yasuhisa HIROSE ,  Takahiro MINATANI

IPC: F16K31/06 ,  F16K3/18 ,  F16K3/316 ,  F16K11/065

Abstract: A flow path switching valve includes (a) a valve body in a shape of a rectangular parallelepiped having a predetermined surface and an opposite surface, the valve body including an open flow passage having an opening on the predetermined surface, (b) a main body including a plurality of ports having a respective opening on a facing surface thereof facing the predetermined surface, and a plurality of connection flow passages each connected to respective one of the plurality of ports, (c) a pair of plate springs attached to opposite ends of the valve body to support the valve body with a predetermined gap formed between the predetermined surface and the facing surface, the plate springs applying elastic force to the valve body in accordance with an amount of movement of the valve body in a predetermined direction, and (d) an actuator for reciprocating the valve body in the predetermined direction.

公开(公告)号：US20190011052A1

公开(公告)日：2019-01-10

申请号：US16127807

申请日：2018-09-11

Applicant: CKD Corporation

Inventor： Akihiro ITO ,  Masayuki KOUKETSU ,  Keiichi NISHIKAWA ,  Yasuhisa HIROSE ,  Takahiro MINATANI

IPC: F16K3/18 ,  F16K3/316 ,  F16K31/06

Abstract: The flow path switching valve includes (a) a valve body having an open flow path which opens on a predetermined surface over a predetermined length in a predetermined direction, (b) a main body having a plurality of ports which open on a facing surface facing the predetermined surface at an interval shorter than the predetermined length in the predetermined direction, and a plurality of connection flow paths connected to the plurality of ports, (c) plate springs attached on both ends of the valve body in the predetermined direction so as to support the valve body such that a predetermined gap is formed between the predetermined surface and the facing surface, the plate springs applying elastic force onto the valve body according to a movement amount of the valve body in the predetermined direction, and (d) an actuator which drives the valve body back and forth in the predetermined direction.

公开(公告)号：US20180269090A1

公开(公告)日：2018-09-20

申请号：US15988128

申请日：2018-05-24

Applicant: Tokyo Electron Limited ,  CKD Corporation

Inventor： Atsushi KOBAYASHI ,  Atsuhiko TABUCHI ,  Hideki WAKAI ,  Kazutoshi ITOH ,  Yasuhisa HIROSE ,  Keiichi NISHIKAWA ,  Takahiro MINATANI

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/683

CPC classification number: H01L21/67248 ,  H01L21/67109 ,  H01L21/6831 ,  H01L22/10

Abstract: A temperature control system includes a first temperature adjustment unit storing fluid at a first temperature; a second temperature adjustment unit storing fluid at a second temperature higher than the first temperature; a low-temperature flow path for passing fluid supplied from the first temperature adjustment unit; a high-temperature flow path for passing fluid supplied from the second temperature adjustment unit; a bypass flow path for circulating fluid; a combination flow path for passing fluid from the low-temperature flow path, the high-temperature flow path, and the bypass flow path merged at a merging part; a temperature adjustment part that passes fluid from the combination flow path and cools/heats a member of a semiconductor manufacturing device; and a control device that controls valve positions of variable valves attached to the three flow paths upstream of the merging part and adjusts the flow rate distribution ratio for the three flow paths.