公开(公告)号：US20170287625A1

公开(公告)日：2017-10-05

申请号：US15619355

申请日：2017-06-09

Applicant: CKD Corporation

Inventor： Akihiro ITO ,  Masayuki KOUKETSU ,  Takashi HOSONO ,  Sadayoshi MUTO ,  Takashi TASAKI ,  Yuji OGAWA

IPC: H01F27/28 ,  H01F27/32

CPC classification number: H01F27/2876 ,  H01F5/06 ,  H01F7/06 ,  H01F27/16 ,  H01F27/2847 ,  H01F27/2852 ,  H01F27/324

Abstract: A coil cooling structure comprises a coil which includes a strip-shaped conductor wound around a specific axis a plurality of times; an alumina layer which is formed on an end surface of the coil in the direction of the specific axis through thermal spraying of alumina and whose surface is flattened; a cooling plate which is mainly formed of alumina and has a flow passage for a cooling medium; and an adhesive which bonds the alumina layer and the cooling plate and which elastically deforms depending on a difference in thermal expansion between the alumina layer and the cooling plate.