公开(公告)号：US09634371B2

公开(公告)日：2017-04-25

申请号：US14571846

申请日：2014-12-16

Applicant: COM DEV International Ltd.

Inventor： Arvind Swarup ,  David Davitt

IPC: H01P5/08 ,  H03H7/38 ,  H01P11/00 ,  H01P5/02

CPC classification number: H01P5/08 ,  H01P5/028 ,  H01P11/00 ,  H03H7/38 ,  Y10T29/49004

Abstract: A transmission line circuit assembly has a substrate layer having a transmission line trace, further having a functional portion and a transitional portion. An enclosure of the assembly houses the transitional portion of the transmission line trace. A first surface of a dielectric plug is conductively coupled to an inner top surface of the enclosure. A second surface of the plug is aligned and spaced apart from the transitional portion of the transmission line trace to define a gap therebetween. An interfacing portion of a connecting pin is housed within the enclosure and bonded to the transitional portion. A connecting portion of the pin is connectable to an external conductor. The gap may be filled with a dielectric material. The transitional portion, dielectric plug, dielectric filler and connecting pin form an electromagnetic transition providing tuning and matching of the function portion with the external conductor.