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公开(公告)号:US20240332767A1
公开(公告)日:2024-10-03
申请号:US18612528
申请日:2024-03-21
Inventor: Karim Glâtre
Abstract: Provided are apparatuses and methods for a tri-frequency feedchain configured to combine at least three frequency bands on a waveguide. The feedchain includes a turnstile configured to support two orthogonal fundamental modes and combine six filtered signals and a third signal and output the combined signal via an output port. The feedchain also includes at least six filters disposed about the turnstile configured to filter a split signal into the filtered signals. The turnstile is a junction for the filters and includes a port at the interface of each filter and the turnstile for receiving the filtered signal. The turnstile includes a third signal port configured to receive the third signal. The split signals are of an intermediary frequency band comprising a first and second frequency band and the third signal is of a third frequency band. The first, second, and third frequency bands do not intersect.
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公开(公告)号:US20240088537A1
公开(公告)日:2024-03-14
申请号:US17941250
申请日:2022-09-09
Inventor: Manohar Deshpande , Eleanya Onuma
Abstract: This application describes an apparatus and system for a Wide band end launcher to convert a signal in a coaxial line to a CPW line. The apparatus uses a transition zone which gradually tapers in two inclined planes from the coaxial line to the CPW line, connecting the central conductor of the coaxial line to the central conductor of the CPW line. In addition, the outer conductor of the coaxial line is connected to the ground plates of the CPW line. This allows for high bandwidth transfers between the two types of lines for accurate measurements and other purposes.
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公开(公告)号:US11777461B2
公开(公告)日:2023-10-03
申请号:US17690802
申请日:2022-03-09
Applicant: ENGIN-IC, Inc.
Inventor: Stephen R. Nelson
IPC: H03F3/16 , H03F3/60 , H03F1/56 , H03F3/195 , H03F3/24 , H03F1/34 , H01P3/08 , H01P5/08 , H01L29/772 , H01P3/02
CPC classification number: H03F3/604 , H01L29/772 , H01P3/026 , H01P3/081 , H01P5/08 , H03F1/342 , H03F1/565 , H03F3/195 , H03F3/245 , H01L2924/1306
Abstract: According to an embodiment of the disclosure, a series or source feedback is provided to a solid-state power amplifier to achieve improved amplifier output power, good impedance match, and low voltage standing wave ratio (VSWR). In an embodiment, an inductive element is coupled to the source of the power amplifier transistor to serve as a series or source feedback for the transistor. In an embodiment, a high-impedance microstrip is provided as an inductive element coupled to the source of the transistor. In an embodiment, a series or source feedback is provided to each amplifier in a multistage amplifier circuit. In an embodiment, a greater series or source feedback is provided at a later stage of a multistage amplifier circuit, whereas a smaller series or source feedback is provided at an earlier stage of the multistage amplifier circuit.
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公开(公告)号:US20190198962A1
公开(公告)日:2019-06-27
申请号:US16287046
申请日:2019-02-27
Applicant: AT&T Intellectual Property I, L.P.
Inventor: Paul Shala Henry , Donald J. Barnickel , Farhad Barzegar , Robert Bennett , Irwin Gerszberg , Thomas M. Willis, III
Abstract: Aspects of the subject disclosure may include, for example, a coupling module that includes a waveguide that guides a first electromagnetic wave conveying data from a transmitting device. A dielectric coupler receives the first electromagnetic wave from the waveguide to form a second electromagnetic wave, and that guides the second electromagnetic wave along the dielectric coupler adjacent to a transmission medium, and wherein the dielectric coupler has a length that supports a cancellation of at least one cancelled wave mode from a coupling of the second electromagnetic wave to the transmission medium.
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公开(公告)号:US20190148808A1
公开(公告)日:2019-05-16
申请号:US16098062
申请日:2016-07-05
Applicant: Mitsubishi Electric Corporation
Inventor: Hiromasa NAKAJIMA , Akimichi HIROTA , Naofumi YONEDA , Takeshi OSHIMA
Abstract: A hollow-waveguide-to-planar-waveguide transition circuit includes: a dielectric substrate; strip conductors formed on a first main surface of the dielectric substrate; a ground conductor formed on a second main surface of the dielectric substrate, facing the strip conductors in the thickness direction; a slot formed in the ground conductor; a coupling conductor formed at a position to be electrically coupled with the strip conductors on the first main surface; and branch conductor lines formed on the first main surface. Each of the branch conductor lines includes a base portion branching from the coupling conductor and a tip portion that is electrically open.
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公开(公告)号:US10085337B2
公开(公告)日:2018-09-25
申请号:US15165489
申请日:2016-05-26
Applicant: INSTITUT NATIONAL D'OPTIQUE
Inventor: Christophe Fisné , Alex Paquet , Bruno Fisette
CPC classification number: H05K1/0243 , H01L23/057 , H01L23/66 , H01L2223/6627 , H01L2223/6683 , H01L2223/6694 , H01P3/08 , H01P5/08 , H01P5/085 , H01R9/0515
Abstract: The coaxial cable assembly generally has a coaxial cable; and a connector assembled to an end of the coaxial cable, the connector having a dielectric body having a connecting surface, a longitudinal groove recessed in the connecting surface and having a groove end spaced from an edge of the connecting surface, and a coplanar waveguide along the connecting surface, the coplanar waveguide having a signal conductor extending from the groove end to the edge and between ground conductors each extending from a respective lateral side of the longitudinal groove to the edge; the end of the coaxial cable being received in the longitudinal groove and having an inner conductor electrically connected to the signal conductor and an outer conductor electrically connected to the ground conductors in a manner allowing connection of the coaxial cable with another coplanar waveguide of an integrated circuit.
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公开(公告)号:US20180261901A1
公开(公告)日:2018-09-13
申请号:US15980646
申请日:2018-05-15
Applicant: Huawei Technologies Co., Ltd.
Inventor: Chuanan ZHANG , Yi CHEN
CPC classification number: H01P1/2088 , H01P3/081 , H01P3/121 , H01P5/08 , H01P7/065
Abstract: A filter unit and a filter are disclosed. The filter unit includes two stacked cavities. Each cavity includes a dielectric substrate, and two surfaces of the dielectric substrate are each provided with a metal covering layer. Connected coupling slots and a row of metal slots parallel to the coupling slots are etched on a metal covering layer. One end of a coupling slot is an open end, and the other end is a closed end. The open end corresponds to a magnetic wall structure, and the closed end corresponds to an electric wall structure. The two cavities are coupled and connected by using the coupling slots.
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公开(公告)号:US10069185B2
公开(公告)日:2018-09-04
申请号:US15440500
申请日:2017-02-23
Applicant: AT&T INTELLECTUAL PROPERTY I, L.P.
Inventor: Paul Shala Henry , Robert Bennett , Farhad Barzegar , Irwin Gerszberg , Donald J. Barnickel , Thomas M. Willis, III
CPC classification number: H01P5/19 , H01P1/16 , H01P3/10 , H01P3/127 , H01P3/16 , H01P5/08 , H01Q13/025 , H04B3/52 , H04B3/56 , H04W84/045
Abstract: Aspects of the subject disclosure may include, for example, a system for generating first electromagnetic waves and directing instances of the first electromagnetic waves to an interface of a transmission medium to induce propagation of second electromagnetic waves having at least a dominant non-fundamental wave mode. Other embodiments are disclosed.
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公开(公告)号:US10051483B2
公开(公告)日:2018-08-14
申请号:US14885418
申请日:2015-10-16
Applicant: AT&T INTELLECTUAL PROPERTY I, LP
Inventor: Farhad Barzegar , Paul Shala Henry , Donald J Barnickel , Robert Bennett , Irwin Gerszberg , Henry Kafka , Thomas M. Willis, III
IPC: H04W16/28 , H01Q13/24 , H01Q19/08 , H04B7/06 , H04W84/04 , H01P1/16 , H01P5/08 , H01Q3/26 , H04B3/52
CPC classification number: H04W16/28 , H01P1/16 , H01P5/08 , H01Q3/26 , H01Q13/24 , H01Q19/08 , H04B3/52 , H04B7/0617 , H04W84/042
Abstract: Aspects of the subject disclosure may include, for example, a method for receiving a request to steer wireless signals generated by a plurality of dielectric antennas, and adjusting, by the controller, a plurality of adjustable delays coupled to a transceiver to adjust an orientation of wireless signals received or generated by the plurality of dielectric antennas, each of the plurality of dielectric antennas comprising a feed point coupled to a different one of the plurality of adjustable delays, the transceiver facilitating reception or transmission of electromagnetic waves propagating via a different one of the feed points of the plurality of dielectric antennas along corresponding dielectric feedlines without an electrical return path. Other embodiments are disclosed.
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公开(公告)号:US10038232B2
公开(公告)日:2018-07-31
申请号:US15222119
申请日:2016-07-28
Applicant: International Business Machines Corporation
Inventor: Bing Dang , Duixian Liu , Jean-Olivier Plouchart , Alberto Valdes-Garcia
IPC: H01P5/107 , H01P5/02 , H01P3/12 , H01P3/08 , H01P5/08 , H01L23/498 , H01L23/66 , H01L25/065 , H01P3/16 , H01Q1/38 , H01Q1/48 , H01Q1/50 , H01L23/538 , H01L23/00 , H05K1/02
CPC classification number: H01P5/107 , H01L23/49827 , H01L23/49838 , H01L23/5384 , H01L23/5386 , H01L23/66 , H01L24/16 , H01L25/0655 , H01L2223/6616 , H01L2223/6627 , H01L2223/6633 , H01L2223/6677 , H01L2224/16225 , H01L2224/16235 , H01L2224/17181 , H01L2924/10253 , H01L2924/1421 , H01L2924/15311 , H01L2924/15313 , H01L2924/19031 , H01L2924/19032 , H01L2924/19033 , H01L2924/19039 , H01P3/08 , H01P3/121 , H01P3/16 , H01P5/02 , H01P5/08 , H01P5/087 , H01Q1/2283 , H01Q1/38 , H01Q1/48 , H01Q1/50 , H05K1/0243 , H05K2201/037 , H05K2201/10522
Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.
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