METHOD FOR ACTIVATING AN EXPOSED LAYER
    1.
    发明公开

    公开(公告)号:US20230201871A1

    公开(公告)日:2023-06-29

    申请号:US18068759

    申请日:2022-12-20

    CPC classification number: B05D3/145 B05D1/62 B05D2203/30

    Abstract: A method for activating an exposed layer of a structure including a provision of a structure including an exposed layer, and before or after the provision of the structure, a deposition in the reaction chamber of a layer based on a material of chemical formula CxHyFz, at least x and z being non-zero. The method further includes a treatment, in the presence of the structure, of the layer based on a material of chemical formula CxHyFz by an activation plasma based on at least one from among oxygen and nitrogen. The treatment by the activation plasma is configured to consume at least partially the layer based on the material of chemical formula CxHyFz so as to activate the exposed layer of the structure.

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