公开(公告)号：US10388845B2

公开(公告)日：2019-08-20

申请号：US15769092

申请日：2016-10-20

Applicant: CONSORZIO DELTA TI RESEARCH

Inventor： Danilo Mascolo ,  Antonietta Buosciolo ,  Giuseppe Latessa ,  Giuseppe Gammariello ,  Marco Giusti ,  Italo Gison

IPC: H01L35/32 ,  H01L27/16 ,  H01L35/22 ,  H01L35/30 ,  H01R13/73 ,  H01L35/34

Abstract: A thermoelectric generator of compact size, having a simple structure configured for increasing the conversion efficiency of thermal energy into electric energy, so as it is possible to transform into electric current also as amount of heat per unit surface greater than thin film prior art devices, has a base silicon wafer and a cover silicon wafer, wherein the cover silicon wafer is facing said base silicon wafer in such a way that the respective top contacts are in contact and the space between the cover silicon wafer and the base silicon wafer is a space in which vacuum is made or a gas is present, in particular air.

公开(公告)号：US10003002B2

公开(公告)日：2018-06-19

申请号：US15464987

申请日：2017-03-21

Applicant: Consorzio Delta Ti Research

Inventor： Danilo Mascolo ,  Antonietta Buosciolo ,  Italo Gison ,  Giuseppe Gammariello

IPC: H01L35/30 ,  H01L35/32 ,  H01L35/22 ,  H01L35/34

CPC classification number: H01L35/32 ,  H01L35/22 ,  H01L35/30 ,  H01L35/34

Abstract: Disclosed are two geometrically identical integrated Z-device structures, integrated in two distinct silicon dices, joined together in a face-to-face configuration, such that a p-doped thin film leg of one structure faces toward a n-doped thin film leg of the other structure and vice versa. Upon joining the Z-device structures together, the hill-top metal contacts of one integrated structure are bonded in electrical and thermal continuity with correspondent hill-top metal contacts of the other integrated structure, forming a substantially bivalve TEG of increased power yield for the same footprint area and having an enhanced conversion efficiency. Thermo-electrically generated current may be gathered from one or several end pad pairs, the pads of which are connected to respective valley bottom contacts, on one and on the other of the two dices of the bivalve device, at the ends of conductive lines of micro cells respectively belonging to one and to the other of the two coupled dices.