WINDING DEVICE AND MATERIAL WINDING METHOD
    1.
    发明公开

    公开(公告)号:US20230402641A1

    公开(公告)日:2023-12-14

    申请号:US18456233

    申请日:2023-08-25

    CPC classification number: H01M10/0409 H01M10/286

    Abstract: A winding device and a material winding method are provided. The winding device is configured to wind a material and includes: a winding switching mechanism, a compounding mechanism and a breaking mechanism. The winding switching mechanism includes a rotating disc and a plurality of winding pins arranged on the rotating disc at intervals. The material is wound around one winding pin along a preset path. The compounding mechanism is provided upstream of the winding pin along the preset path and configured to laminate and then compound the plural layers of materials at a preset position. The breaking mechanism is provided between the compounding mechanism and any winding pin along the preset path and configured to break the compounded plural layers of materials at a compounding region.

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