公开(公告)号：US20210154985A1

公开(公告)日：2021-05-27

申请号：US17091844

申请日：2020-11-06

Applicant: CORNING INCORPORATED

Inventor： Bavani Balakrisnan ,  Brian Joseph Hanlon ,  Joydeep Lahiri ,  Bryan Patrick Livengood ,  Timothy James Orsley

IPC: B32B27/14 ,  B32B5/16

Abstract: According to various examples of the present disclosure, an antimicrobial assembly includes a substrate comprising a matrix material having opposed first and second surfaces with a total thickness of the substrate defined therebetween. The assembly further includes an antimicrobial composition bound to the substrate and heterogeneously distributed about the antimicrobial assembly.

公开(公告)号：US20220264889A1

公开(公告)日：2022-08-25

申请号：US17631980

申请日：2020-08-04

Applicant: Corning Incorporated

Inventor： Bavani Balakrisnan ,  David Michael Fasano ,  Bryan Patrick Livengood ,  Joseph Martin Rokowski

IPC: A01N59/20 ,  A01N25/04 ,  A01N25/24 ,  A01P1/00

Abstract: According to various examples of the present disclosure, a biocidal dispersion includes one or more inorganic glass comprising copper particles. The biocidal dispersion further includes a dispersant, a thickener, or a mixture thereof. The inorganic glass comprising copper is homogenously distributed about the biocidal dispersion and is in a range of from about 3 wt % to about 88 wt % of the biocidal dispersion.